Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/200280
Kind Code:
A1
Abstract:
An electronic component (100) is provided with a mounting substrate (200), and a first device (101) and a second device (102) each including a function element. The first device (101) is spaced apart from the mounting substrate (200) and disposed opposite the mounting substrate (200). The second device (102) is disposed on the mounting substrate (200) opposite the first device (101). The function element (120) of the first device (101) is disposed on a first surface (112) of the first device (101) opposite the second device (102). The function element (125) of the second device (102) is disposed on a second surface (116) of the second device (102) opposite the first device (101).
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| WO/2002/001716 | SAW DEVICE |
| JP2007059746 | ELECTRONIC COMPONENT STORAGE PACKAGE AND ELECTRONIC APPARATUS |
Inventors:
YAMAJI TORU (JP)
Application Number:
PCT/JP2021/011423
Publication Date:
October 07, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H03H9/25
Foreign References:
| JP2018093057A | 2018-06-14 | |||
| JP2007251391A | 2007-09-27 | |||
| JP2007060465A | 2007-03-08 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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