Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/255036
Kind Code:
A1
Abstract:
An electronic component (101) comprises: a semiconductor substrate (1); an insulator layer (2) formed on the semiconductor substrate (1); a lower electrode (31) formed opposite the semiconductor substrate (1) with the insulator layer (2) therebetween; an upper electrode (32); and a dielectric layer (4) formed opposite the semiconductor substrate (1) with the insulator layer (2) therebetween. The lower electrode (31), the upper electrode (32), and the dielectric layer (4) constitute a passive component. The insulator layer (2) has a conductive path (5) formed through the insulator layer (2), providing electrical continuity between the lower electrode (31) and the semiconductor substrate (1).
Inventors:
NAKAISO TOSHIYUKI (JP)
Application Number:
PCT/JP2022/019748
Publication Date:
December 08, 2022
Filing Date:
May 10, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01G4/30; H01G4/33; H01L21/822; H01L27/04
Domestic Patent References:
| WO2014069363A1 | 2014-05-08 | |||
| WO2010052839A1 | 2010-05-14 |
Foreign References:
| JP2009076483A | 2009-04-09 | |||
| JP2002305246A | 2002-10-18 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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