Title:
ELECTRONIC CONTROL DEVICE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/038891
Kind Code:
A1
Abstract:
An electronic control device (1) has a cover (30) (housing). The cover (30) (housing) is configured by at least a metal layer (32), a plating layer (33), an exposed site (32a), and sealing tape (70) (lid). Specifically, the cover (30) (housing) comprises: the metal layer (32) composed of metal; the plating layer (33) which covers an outer surface of the metal layer (32); the exposed site (32a) in which the metal layer (32) is exposed from a portion of the plating layer (33); and the sealing tape (70) (lid) which covers the metal layer (32) exposed through the exposed site (32a).
Inventors:
SHIGYO TOSHIKAZU (JP)
Application Number:
PCT/JP2021/023654
Publication Date:
February 24, 2022
Filing Date:
June 22, 2021
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H05K5/03
Domestic Patent References:
| WO2018173928A1 | 2018-09-27 |
Foreign References:
| JP2017136839A | 2017-08-10 |
Attorney, Agent or Firm:
KAICHI IP (JP)
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