Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/087744
Kind Code:
A1
Abstract:
This electronic control device has: a heat generating component including an electronic component; a substrate on which the heat generating component is mounted; and a metal housing that fixes the substrate via a substrate fixing section. The metal housing is provided with: a conductive section, which is disposed facing the substrate, and which conducts heat generated by the heat generating component; and one or more leg sections, which are formed protruding from the conductive section to the substrate side, and which are connected to the substrate. The heat generating component is thermally connected to, via a heat dissipating material, a conductive section surface facing the heat generating component.
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| WO/1992/011606 | METHOD AND SYSTEM FOR THERMAL MODELLING OF A COMPONENT |
Inventors:
KAWAKITA SHINYA (JP)
SAKAMOTO HIDEYUKI (JP)
SAKAMOTO HIDEYUKI (JP)
Application Number:
PCT/JP2018/038224
Publication Date:
May 09, 2019
Filing Date:
October 12, 2018
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K7/20; H01L23/40
Domestic Patent References:
| WO2005020281A2 | 2005-03-03 |
Foreign References:
| JP2015088629A | 2015-05-07 | |||
| JP2006156465A | 2006-06-15 | |||
| JP2003086976A | 2003-03-20 | |||
| JP2014093414A | 2014-05-19 | |||
| JP2000216570A | 2000-08-04 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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