Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/146391
Kind Code:
A1
Abstract:
Provided is an electronic control device configured to be capable of improving heat dissipation of an electronic component. This electronic control device 11 comprises a circuit board 30 for mounting an electronic component 32, and a case 20 for containing the circuit board 30, wherein a portion of the case 20 has a metal plate 51 provided so as to oppose the electronic component 32, and the outer surface of the metal plate 51 is covered by a second resin film 53 of which the thickness is less than that of the metal plate 51. The inner surface of the metal plate 51 is covered by a first resin film 52 of which the thickness is greater than that of the metal plate 51.
Inventors:
FUKUZAWA TAKAYUKI (JP)
KAWAI YOSHIO (JP)
KANEKO YUJIRO (JP)
KAWAI YOSHIO (JP)
KANEKO YUJIRO (JP)
Application Number:
PCT/JP2019/000143
Publication Date:
August 01, 2019
Filing Date:
January 08, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K7/20; H01L23/40; H05K5/00
Foreign References:
| JP2017098418A | 2017-06-01 | |||
| JP2014209459A | 2014-11-06 | |||
| JP2017112221A | 2017-06-22 | |||
| JP2001298289A | 2001-10-26 | |||
| JP2014220921A | 2014-11-20 | |||
| JP2013100477A | 2013-05-23 |
Attorney, Agent or Firm:
TODA Yuji (JP)
Download PDF: