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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/215977
Kind Code:
Provided is an electronic control device with which it is possible to improve heat dissipation performance with a simple structure. An electronic control device comprising a bottomed cylindrical casing 10 in which one end is an opening 11, and a printed substrate 20 inserted into the casing 10 via the opening 11, wherein the casing 10 has formed therein a slit 15 through which is inserted part of a heat sink 22 mounted on the printed substrate 20 housed in the casing 10, and via which part of the heat sink 22 is exposed to the exterior of the casing 10.

NAMBU Hiroi (2520, Takaba, Hitachinaka-sh, Ibaraki 03, 〒3128503, JP)
Application Number:
Publication Date:
November 14, 2019
Filing Date:
February 14, 2019
Export Citation:
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HITACHI AUTOMOTIVE SYSTEMS, LTD. (2520, Takaba Hitachinaka-sh, Ibaraki 03, 〒3128503, JP)
International Classes:
H05K7/20; B60R16/02; H05K5/00; H05K7/14
Attorney, Agent or Firm:
TODA Yuji (6-1, Marunouchi 1-chome, Chiyoda-k, Tokyo 20, 〒1008220, JP)
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