ELECTRONIC CONTROL DEVICE

WIPO Patent Application WO/2024/048624

A1

A housing (2) accommodating a circuit board has a body member (3) covering one side of the circuit board, and a cover member (4) covering the side of the circuit board opposite the body member (3). The body member (3) has a sealing groove (8) which is located further outward than the accommodation position of the circuit board and is filled with a sealant, and a first linking section (15) provided inside the sealing groove (8). The cover member (4) has an outer peripheral cover wall (22), the leading edge of which is inserted into the sealing groove (8), and a second linking section (25) provided to the outer peripheral cover wall (22). The second linking section (25) links to the first linking section (15) inside the sealing groove (8) so as not to cause the leading edge of the outer peripheral cover wall (22) to slip out of the sealing groove (8).

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JP6497148	Manufacturing method of housing with cover
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MIYAZAWA YUDAI (JP)
WATANABE HIROFUMI (JP)

PCT/JP2023/031388

March 07, 2024

August 30, 2023

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HITACHI ASTEMO LTD (JP)

H05K5/06; B60R16/02

CN113453476A	2021-09-28
JP2013004551A	2013-01-07
JP2013545173A	2013-12-19
JP2011204974A	2011-10-13
JP2002221209A	2002-08-09
JP2009117674A	2009-05-28
JP2013193719A	2013-09-30
JP2007043870A	2007-02-15

KOBAYASHI, Hiromichi et al. (JP)

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