Title:
ELECTRONIC DEVICE AND ELECTRONIC DEVICE CASING
Document Type and Number:
WIPO Patent Application WO/2022/137962
Kind Code:
A1
Abstract:
The present invention provides an electronic device and an electronic device casing which suppress concentration of heat by a simple structure. An electronic device (1) comprises a heating element (91), an encasing part (100), a plurality of first vent holes (111), (121), (131), a plurality of space parts (110), (120), (130), and a plurality of second vent holes (112), (122), (132). The heating element (91) includes an electric circuit. The encasing part (100) encases the heating element (91). The first vent holes are provided at a destance from each other in a horizontal direction above the encasing part (100). The plurality of space parts are respectively provided for each first vent hole above the first vent holes. The plurality of second vent holes are respectively provided for each space part above the space parts.
Inventors:
IMURA WATARU (JP)
Application Number:
PCT/JP2021/043107
Publication Date:
June 30, 2022
Filing Date:
November 25, 2021
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H05K7/20
Foreign References:
| JPS4735907U | 1972-12-21 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
Download PDF:
Previous Patent: TOOTHBRUSH
Next Patent: PANEL SECURING STRUCTURE IN METAL BASE ROOF, PANEL SECURING MEMBER AND PANEL SECURING METHOD USED IN...
Next Patent: PANEL SECURING STRUCTURE IN METAL BASE ROOF, PANEL SECURING MEMBER AND PANEL SECURING METHOD USED IN...