Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/212549
Kind Code:
A1
Abstract:
An electronic device, according to various embodiments of the present invention, may comprise: a housing which comprises a first surface, a second surface facing the opposite direction from the first surface, and a cooling member arranged between the first surface and the second surface; a circuit board which is disposed inside the housing; at least one heating component which is mounted to the circuit board; a shield can which surrounds one portion of the at least one heating component; a conductive member which makes contact with a first surface of the at least one heating component; a first thermal conduction member which diffuses heat from the at least one heating component towards the direction of a surface that is parallel with the first surface of the heating component; and a second thermal conduction member which makes contact with a first surface of the first thermal conduction member, receives the heat from the first thermal conduction member in a second direction perpendicular to a first direction, and transfers the heat to the cooling member. In addition, various embodiments are possible.
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Inventors:
KIM MIN-SOO (KR)
LEE JI-WOO (KR)
LEE JI-WOO (KR)
Application Number:
PCT/KR2018/005538
Publication Date:
November 22, 2018
Filing Date:
May 15, 2018
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H05K9/00
Foreign References:
| KR20150108262A | 2015-09-25 | |||
| JP2016081978A | 2016-05-16 | |||
| JP2009060048A | 2009-03-19 | |||
| JP2507561B2 | 1996-06-12 | |||
| KR101459223B1 | 2014-11-26 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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