Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2021/215708
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure may comprise: a housing comprising a front plate and a rear plate; a printed circuit board disposed between the front plate and the rear plate; a wireless charging coil disposed between the printed circuit board and the rear plate; and a heat dissipation sheet disposed between the wireless charging coil and the rear plate. The heat dissipation sheet may comprise a heat dissipation filler comprising: a first heat dissipation filler including a flake-type graphite; and a second heat dissipation filler having an electrical resistance higher than the electrical resistance of the first heat dissipation filler, wherein the weight of the first heat dissipation filler may be 80 wt% to 93 wt% of the whole weight of the heat dissipation sheet.
Inventors:
YUN HAJOONG (KR)
KIM JINMYOUNG (KR)
LEE JINHYOUNG (KR)
KANG SEUNGHOON (KR)
KOO KYUNGHA (KR)
MOON HONGKI (KR)
PARK YOONSUN (KR)
YANG SEYOUNG (KR)
KIM JINMYOUNG (KR)
LEE JINHYOUNG (KR)
KANG SEUNGHOON (KR)
KOO KYUNGHA (KR)
MOON HONGKI (KR)
PARK YOONSUN (KR)
YANG SEYOUNG (KR)
Application Number:
PCT/KR2021/004364
Publication Date:
October 28, 2021
Filing Date:
April 07, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
AMOTECH CO LTD (KR)
AMOTECH CO LTD (KR)
International Classes:
H05K7/20; H02J50/10
Foreign References:
| KR20140031358A | 2014-03-12 | |||
| JP2017008321A | 2017-01-12 | |||
| KR20190055772A | 2019-05-23 | |||
| KR101762030B1 | 2017-07-26 | |||
| KR102092675B1 | 2020-03-24 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: