Title:
ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/260422
Kind Code:
A1
Abstract:
An electronic device of the present application comprises: a heat generation source comprising a heat dissipation surface dissipating heat; a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source; a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed; a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member; and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member. The adhesive member applies pressure to the area of the heat dissipation member in which the thermal interface material is supported by the support member, and, by pressing the area in which the adhesive member is disposed, the thermal interface material may come into close contact with an area of the heat dissipation member facing the heat dissipation surface.
Inventors:
KIM YOUNGWOOK (KR)
LIM SUNGWOO (KR)
LIM CHANKYU (KR)
YOON JONGGEUN (KR)
LEE JIWOO (KR)
LIM SUNGWOO (KR)
LIM CHANKYU (KR)
YOON JONGGEUN (KR)
LEE JIWOO (KR)
Application Number:
PCT/KR2022/008066
Publication Date:
December 15, 2022
Filing Date:
June 08, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; C08K7/02; H05K9/00
Foreign References:
| KR20170097541A | 2017-08-28 | |||
| KR20200017115A | 2020-02-18 | |||
| US20090213548A1 | 2009-08-27 | |||
| KR20160009914A | 2016-01-27 | |||
| JP2019186310A | 2019-10-24 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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