Title:
ELECTRONIC DEVICE COMPRISING HOUSING, AND HOUSING MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/169308
Kind Code:
A1
Abstract:
Provided is an electronic device comprising a housing, wherein the housing comprises: a base resin for forming the shape of the housing; a particle resin arranged in at least a part of the base resin; a UV stabilizer; and a rheology modifier, the melting point of the particle resin is higher than the melting point of the base resin, and the housing can be formed through a chamfer structure comprising one gate. Other various embodiments are possible.
Inventors:
HWANG HANGYU (KR)
SINGH RATHOREPRANVEER (KR)
KIM BONGJOON (KR)
LEE JINSOO (KR)
YOO MINWOO (KR)
SINGH RATHOREPRANVEER (KR)
KIM BONGJOON (KR)
LEE JINSOO (KR)
YOO MINWOO (KR)
Application Number:
PCT/KR2022/001776
Publication Date:
August 11, 2022
Filing Date:
February 04, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B29C45/00; B29B9/00; C08K5/34; H05K5/00; B29K67/00; B29K69/00; B29K77/00; B29L31/34
Foreign References:
| KR20070104246A | 2007-10-25 | |||
| KR20110026240A | 2011-03-15 | |||
| KR20180044258A | 2018-05-02 | |||
| US20090301748A1 | 2009-12-10 | |||
| KR20190064263A | 2019-06-10 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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