Title:
ELECTRONIC DEVICE COMPRISING PLURALITY OF CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2024/014911
Kind Code:
A1
Abstract:
An electronic device according to an embodiment of the present disclosure may comprise: a first printed circuit board comprising a first region corresponding to a first electronic component and a second region which does not overlap the first region and which corresponds to a second electronic component; a second printed circuit board comprising a first surface which faces a first direction, and a second surface which faces a second direction opposite to the first direction and faces the first printed circuit board; and a heat dissipation device which is disposed on the first surface of the second printed circuit board and is connected to the first electronic component via a first thermal interface material (TIM). Various other embodiments may also be applied.
Inventors:
KIM JICHUL (KR)
YE JAEHEUNG (KR)
LEE KYUHWAN (KR)
JUNG KWANGHO (KR)
YE JAEHEUNG (KR)
LEE KYUHWAN (KR)
JUNG KWANGHO (KR)
Application Number:
PCT/KR2023/010060
Publication Date:
January 18, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; C09K5/14; H04M1/02; H05K1/14; H05K7/20
Foreign References:
| KR20150038448A | 2015-04-08 | |||
| US20200357721A1 | 2020-11-12 | |||
| JP2006054274A | 2006-02-23 | |||
| US20060133043A1 | 2006-06-22 | |||
| KR20090130087A | 2009-12-17 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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