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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/080016
Kind Code:
A1
Abstract:
An electronic device (100) for use with electric motors comprises: a circuit board (101); an electrical connector wire (150) disposed roughly in the center of the circuit board and connected to a power source; a plurality of motor connector wires (114–116) that are disposed nearer the peripheral edge of the circuit board than the electrical connector wire and connected to an electric motor; and a plurality of semiconductor modules (120) comprising a plurality of semiconductor elements (123b, 124b) and a resin mold (125) that integrally seals the plurality of semiconductor elements. The plurality of semiconductor modules is disposed at positions that are over the electrical connector wires or nearer the peripheral edge than the electrical connector wires and nearer the center than the motor connector wires, and at least some of the electrodes of the plurality of semiconductor modules are mounted on the electrical connector wires.

Inventors:
MIYACHI SYUHEI (JP)
SAITOU ATSUSHI (JP)
FUJITA TOSHIHIRO (JP)
NAGASE NOBORU (JP)
Application Number:
PCT/JP2020/040004
Publication Date:
April 29, 2021
Filing Date:
October 23, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; B62D5/04; H01L25/18; H02M7/48
Domestic Patent References:
WO2015190424A12015-12-17
WO2018207330A12018-11-15
Foreign References:
JP2014043122A2014-03-13
JP2019068542A2019-04-25
JP2017191093A2017-10-19
Attorney, Agent or Firm:
YAMADA, Tsuyoshi (JP)
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