Title:
ELECTRONIC DEVICE COMPRISING SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/186547
Kind Code:
A1
Abstract:
An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a through hole; a sensor module disposed in the through hole, the sensor module including a first electrode having at least a portion exposed to the outside of the housing, and a shaft structure connected to the first electrode and including a protruding area; a printed circuit board disposed in the housing; and a connecting member surrounding at least a portion of the shaft structure and electrically connected to the sensor module and the printed circuit board. Various other embodiments may be possible.
Inventors:
KIM KIJUNG (KR)
KANG JUNGHYUN (KR)
KIM TAEGYUN (KR)
KANG JUNGHYUN (KR)
KIM TAEGYUN (KR)
Application Number:
PCT/KR2022/002731
Publication Date:
September 09, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
A61B5/00; A61B5/024; A61B5/053; G04G17/04; G04G21/02; G06F1/16; H05K1/14
Foreign References:
| KR20190142292A | 2019-12-26 | |||
| KR20120131390A | 2012-12-05 | |||
| JP2016007447A | 2016-01-18 | |||
| JP2013009709A | 2013-01-17 | |||
| KR20030092120A | 2003-12-03 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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