Title:
ELECTRONIC DEVICE COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/081778
Kind Code:
A1
Abstract:
A cooling system 100 in which electronic devices are immersed in coolant and are directly cooled, said cooling system 100 comprising: a cooling tank 11 containing coolant C; a leakage reception unit 21 disposed between the cooling tank 11 and the floor so as to receive coolant L (if any) leaking from the cooling tank 11, said coolant L corresponding to a leakage portion of the coolant C; another leakage reception unit 23, disposed so as to receive coolant L flowing from the leakage reception unit 21 when the volume of leakage coolant L retained in the leakage reception unit 21 is greater than a predetermined volume; and a channel 25 which connects the leakage reception unit 21 and the other leakage reception unit 23, and allows the passage of the coolant L flowing from the leakage reception unit 21 when the volume of leakage coolant retained in the leakage reception unit 21 is greater than the predetermined volume. This configuration facilitates recovering of coolant (if any) leaking from the cooling tank 11, and, furthermore, makes it possible to minimize the height of the equipment for temporarily retaining the leakage coolant L before the leakage coolant is recovered.
Inventors:
SAITO MOTOAKI (JP)
Application Number:
PCT/JP2015/081790
Publication Date:
May 18, 2017
Filing Date:
November 11, 2015
Export Citation:
Assignee:
EXASCALER INC (JP)
International Classes:
G06F1/20; H05K7/20
Foreign References:
| JPH02124415U | 1990-10-12 | |||
| JP2015078745A | 2015-04-23 | |||
| US20130105120A1 | 2013-05-02 |
Other References:
See also references of EP 3376337A4
Attorney, Agent or Firm:
KURODA, Kenji et al. (JP)
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