Title:
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/063554
Kind Code:
A1
Abstract:
An electronic device housing may comprise a mechanical object, a first primer layer provided to cover the mechanical object, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer may have one or more overlapping parts in which the film layers configured to surround the first primer layer overlap each other.
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| WO/2003/058373 | INPUT DEVICE FOR COMPUTER SYSTEM |
| WO/2011/063751 | DATA CARD |
Inventors:
JUNG HYUNJUNG (KR)
HWANG HANGYU (KR)
YOON HYEONSEOK (KR)
KIM HYOIN (KR)
HWANG HANGYU (KR)
YOON HYEONSEOK (KR)
KIM HYOIN (KR)
Application Number:
PCT/KR2022/012218
Publication Date:
April 20, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F3/0354; B32B27/20; C08J7/04; C08J7/043; C08K3/08; C09D5/00; C09D133/00; C09D163/00; C09D167/00; C09D175/04
Foreign References:
| KR20130096922A | 2013-09-02 | |||
| JP2007067154A | 2007-03-15 | |||
| KR20130008795A | 2013-01-23 | |||
| KR102055330B1 | 2020-01-22 | |||
| KR100987346B1 | 2010-10-12 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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