Title:
ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/082443
Kind Code:
A1
Abstract:
Provided are an electronic device housing and a manufacturing method therefor, and an electronic device. The electronic device housing comprises: a housing body, wherein the housing body comprises a bottom wall and at least one side wall connected to the bottom wall, an outer surface of the bottom wall is a flat surface or a curved surface, an outer surface of the side wall is a curved surface, and at least a part of the surface of at least one of the bottom wall and the side wall is provided with a millimeter-scale three-dimensional texture.
Inventors:
LI CONG (CN)
WANG XIAOAN (CN)
WANG XIAOAN (CN)
Application Number:
PCT/CN2020/093964
Publication Date:
May 06, 2021
Filing Date:
June 02, 2020
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H04M1/02
Domestic Patent References:
| WO2014117330A1 | 2014-08-07 |
Foreign References:
| CN210297785U | 2020-04-10 | |||
| CN110769100A | 2020-02-07 | |||
| CN110856384A | 2020-02-28 | |||
| CN107867793A | 2018-04-03 | |||
| CN107867793A | 2018-04-03 | |||
| CN107835276A | 2018-03-23 | |||
| CN206149655U | 2017-05-03 | |||
| CN107750103A | 2018-03-02 | |||
| US20140356563A1 | 2014-12-04 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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