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Patent Searching and Data


Title:
ELECTRONIC DEVICE, HOUSING AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/045662
Kind Code:
A1
Abstract:
The present application relates to the technical field of electronic devices, and discloses an electronic device, a housing and a manufacturing method therefor. The housing comprises a glass fiber plate (100) and a highlight decoration layer (200). The highlight decoration layer (200) is arranged on the outer side surface of the glass fiber plate (100). The glass fiber plate (100) comprises at least one first glass fiber resin layer (110). The first glass fiber resin layer (110) comprises a first resin (111) and a first glass fiber fabric (112). The curing shrinkage rate of the first resin (111) is less than one percent. The electronic device comprises the housing, and the housing manufacturing method is used for manufacturing the housing. Since the glass fiber plate (100) in the housing is made of the first resin with the small curing shrinkage rate, the surface flatness of the glass fiber plate (100) is high, and then a flat highlight effect is presented after the highlight decoration layer (200) is provided. Since there is no need to additionally provide a shielding object on the surface of the glass fiber plate (100), the total thickness of the housing is small.

Inventors:
SHEN KUI (CN)
TAN DONGSHENG (CN)
Application Number:
PCT/CN2023/090904
Publication Date:
March 07, 2024
Filing Date:
April 26, 2023
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
B32B17/02; C08J5/04; H01M50/207; H04M1/02
Foreign References:
CN215897772U2022-02-22
CN106928478A2017-07-07
CN114899539A2022-08-12
CN108638729A2018-10-12
CN205915763U2017-02-01
JP2019077158A2019-05-23
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO.,LTD. (CN)
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