Title:
ELECTRONIC DEVICE HOUSING
Document Type and Number:
WIPO Patent Application WO/2017/047440
Kind Code:
A1
Abstract:
An electronic device housing 1 according to one embodiment of the present invention is provided with a top surface cover 4, a bottom surface cover 2 that stands facing the top surface cover 4 and has a standing wall portion 21 of which the periphery is joined to the top surface cover 4, a partition member 3 that is disposed in a space divided by the top surface cover 4 and the bottom surface cover 2 and has an opening, and a heat generation member, said housing 1 being characterized in that the partition member 3 forms a hollow structure S1 by being joined to the bottom surface cover 2 or the top surface cover 4, and the heat generation member is disposed on the hollow structure S1-side surface of the partition member 3.
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Inventors:
HONMA MASATO (JP)
TAKEBE YOSHIKI (JP)
IMAI NAOKICHI (JP)
FUJIOKA TAKASHI (JP)
TAKEBE YOSHIKI (JP)
IMAI NAOKICHI (JP)
FUJIOKA TAKASHI (JP)
Application Number:
PCT/JP2016/076117
Publication Date:
March 23, 2017
Filing Date:
September 06, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
H05K7/20
Foreign References:
| JPS5827997U | 1983-02-23 | |||
| JP2014239105A | 2014-12-18 | |||
| JPH1117369A | 1999-01-22 | |||
| JP2000190163A | 2000-07-11 | |||
| JP2014123645A | 2014-07-03 | |||
| JPH04125496U | 1992-11-16 | |||
| JP2013062379A | 2013-04-04 |
Other References:
See also references of EP 3352548A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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