Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/184795
Kind Code:
A1
Abstract:
Disclosed in the present disclosure is an electronic device housing, the electronic device housing comprising a substrate, and a sequentially stacked texture layer and coating layer that are located on the substrate, wherein inorganic particles are scattered in the texture layer.

Inventors:
NI, Mingli (No. 3009, BYD Road Pingsha, Shenzhen Guangdong 8, 518118, CN)
ZHOU, Wei (No. 3009, BYD Road Pingsha, Shenzhen Guangdong 8, 518118, CN)
Application Number:
CN2019/079089
Publication Date:
October 03, 2019
Filing Date:
March 21, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BYD COMPANY LIMITED (No. 3009, BYD Road Pingsha, Shenzhen Guangdong 8, 518118, CN)
International Classes:
H05K5/02; H04M1/02
Foreign References:
CN205453807U2016-08-10
CN104754081A2015-07-01
CN104702741A2015-06-10
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (Room 301 Trade Building, Zhaolanyuan Tsinghua University, Qinghuayuan, Haidian District, Beijing 4, 100084, CN)
Download PDF: