ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS

Title:

ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS

Document Type and Number:

WIPO Patent Application WO/2021/081924

Kind Code:

A1

Abstract:

In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

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Inventors:

GUO QINGYONG (CN)
WU KUAN-TING (CN)
CHUANG YACHENG (CN)
GU FENG (CN)

Application Number:

PCT/CN2019/114821

Publication Date:

May 06, 2021

Filing Date:

October 31, 2019

Export Citation:

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Assignee:

HEWLETT PACKARD DEVELOPMENT CO (US)
GUO QINGYONG (CN)
WU KUAN TING (CN)
CHUANG YACHENG (CN)
GU FENG (CN)

International Classes:

C25D5/10; C25D13/00

Domestic Patent References:

WO2016178675A1

2016-11-10

Foreign References:

CN101377000A	2009-03-04
US20090255824A1	2009-10-15

Other References:

SONG ZHENGWEI; YU GANG; XIE ZHIHUI; HU BONIAN; HE XIAOMEI; ZHANG XUEYUAN: "Performance of composite coating on AZ31B magnesium alloy prepared by anodic polarization and electroless electrophoresis coating", SURFACE & COATINGS TECHNOLOGY, vol. 242, 24 January 2014 (2014-01-24), pages 83 - 91, XP028667960, ISSN: 0257-8972, DOI: 10.1016/j.surfcoat.2014.01.022

Attorney, Agent or Firm:

CHINA PATENT AGENT (H.K.) LTD. (CN)

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