Title:
ELECTRONIC DEVICE FOR IMMERSION COOLING, AND PROCESSOR MODULE FOR IMMERSION COOLING
Document Type and Number:
WIPO Patent Application WO/2018/207306
Kind Code:
A1
Abstract:
Provided are an electronic device and a processor module that, even if a relatively tall memory module is mounted, can experience no reduction in packing density, or can further increase packing density. This processor module includes a first circuit board and a second circuit board that each have, on one surface of the board, a processor mounting region and a memory mounting region. At least one processor is mounted to the processor mounting region, and a plurality of memory modules arranged in a comb shape are mounted to the memory mounting region. The one surface of the first circuit board and the one surface of the second surface board are brought together in a facing manner. The first circuit board and the second circuit board are positioned such that the processor mounting region and the memory mounting region of the first circuit board respectively face the processor mounting region and the memory mounting region of the second circuit board, and such that tip end sections of the plurality of memory modules of the first circuit board, said memory modules being arranged in a comb shape, and tip end sections of the plurality of memory modules of the second circuit board, said memory modules being arranged in a comb shape, are alternatingly arranged, with gaps created between neighboring memory modules. A third circuit board is positioned in a space that is formed by upper surfaces of the processors of the first circuit board and the second circuit board facing one another.
Inventors:
SAITO MOTOAKI (JP)
Application Number:
PCT/JP2017/017837
Publication Date:
November 15, 2018
Filing Date:
May 11, 2017
Export Citation:
Assignee:
EXASCALER INC (JP)
International Classes:
G06F1/20; G06F1/18; H05K7/14; H05K7/20
Foreign References:
| US9596787B1 | 2017-03-14 | |||
| JP6042590B1 | 2016-12-14 | |||
| JP2004303842A | 2004-10-28 | |||
| JP2005236089A | 2005-09-02 | |||
| JP2007066480A | 2007-03-15 | |||
| JP2008205402A | 2008-09-04 |
Attorney, Agent or Firm:
KURODA, Kenji et al. (JP)
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