Title:
ELECTRONIC DEVICE INCLUDING BIOMETRIC RECOGNITION MODULE
Document Type and Number:
WIPO Patent Application WO/2023/277336
Kind Code:
A1
Abstract:
According to various embodiments of the present disclosure, an electronic device may comprise: a housing; a protrusion part which protrudes from a side of the housing, and which includes a first window and a second window; a first substrate arranged inside the housing; a second substrate connected to one surface of the first substrate; a first sensor circuit which is arranged on a first surface of the second substrate, and which is arranged to be spaced apart from the bottom of the first window inside the protrusion part; and a second sensor circuit which is arranged on a second surface of the second substrate, opposite to the first surface of the second substrate, and which is arranged to be spaced apart from the top of the second window inside the protrusion part. Various embodiments other than the various embodiments disclosed in the present document are possible.
Inventors:
PARK JIHOON (KR)
KIM HYUNWOO (KR)
HEO JIHUN (KR)
HWANG SEUNGHO (KR)
KIM HYUNWOO (KR)
HEO JIHUN (KR)
HWANG SEUNGHO (KR)
Application Number:
PCT/KR2022/006657
Publication Date:
January 05, 2023
Filing Date:
May 10, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G04G21/02; A61B5/00; A61B5/024; G04G17/04; G04G99/00; G06V40/13
Foreign References:
| JP2002323581A | 2002-11-08 | |||
| US10962935B1 | 2021-03-30 | |||
| KR20210021657A | 2021-03-02 | |||
| US20170090599A1 | 2017-03-30 | |||
| KR20170053385A | 2017-05-16 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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