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Patent Searching and Data


Title:
ELECTRONIC DEVICE INCLUDING CONTACT MEMBER AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
WIPO Patent Application WO/2019/124895
Kind Code:
A1
Abstract:
According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.

Inventors:
JUNG, Taehwa (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
KIM, Youngkyu (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
PARK, Youngmoon (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
AHN, Jaeuk (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
WEE, Jongchun (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
Application Number:
KR2018/015978
Publication Date:
June 27, 2019
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO., LTD. (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
International Classes:
G04G17/02; H01R13/508
Foreign References:
US20170045916A12017-02-16
US20160255733A12016-09-01
US20140086026A12014-03-27
US20130181873A12013-07-18
US20080001832A12008-01-03
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (Mihwa Bldg, 16 Daehak-ro 9-gil,Chongro-gu, Seoul, 03079, KR)
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