Title:
ELECTRONIC DEVICE INCLUDING HEAT RADIATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/107379
Kind Code:
A1
Abstract:
An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.
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Inventors:
JUNG CHUNGHYO (KR)
LIM JAEDEOK (KR)
PARK HYEIN (KR)
YOU JAEHYOUNG (KR)
LIM JAEDEOK (KR)
PARK HYEIN (KR)
YOU JAEHYOUNG (KR)
Application Number:
PCT/KR2020/013476
Publication Date:
June 03, 2021
Filing Date:
October 05, 2020
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/20; G06F1/16; H05K7/20
Foreign References:
| EP3419398A1 | 2018-12-26 | |||
| US20170251549A1 | 2017-08-31 | |||
| US20190320562A1 | 2019-10-17 | |||
| JP2019024074A | 2019-02-14 | |||
| KR20190053589A | 2019-05-20 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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