Title of Invention: ELECTRONIC DEVICE INCLUDING

VIBRATION DAMPING MEMBER

Technical Field

[1] The disclosure relates to a technology for implementing an electronic device

including a vibration damping member.

Background Art

[2] A sound output device, such as a speaker, may be mounted in an electronic device.

When a sound part is driven, the sound output device may vibrate to make a sound. Air adjacent to the sound output device and present in the interior space of the electronic device may vibrate when the sound part vibrates.

[3] The sound output device may vibrate the air in the electronic device while vibrating.

To protect other components or an electrical component in the electronic device and prevent vibration of the electrical component, a fixing member for fixing the electrical component may be disposed in the electronic device.

Disclosure of Invention

Technical Problem

[4] In the case where the thickness of the electrical component in the electronic device is fixed, the electrical component in the electronic device may be fixed by the fixing member, and thus vibration of the other components may be prevented. However, in the case where the thickness of the electrical component in the electronic device is varied, it is not easy to dispose the fixing member to suit any one situation. For example, in the case where the fixing member is disposed to correspond to a small thickness of the electrical component, the electrical component may apply pressure to the interior of the housing of the electronic device, or the housing of the electronic device may inflate, when the thickness of the electrical component is increased. In another example, in the case where the fixing member is disposed to correspond to a large thickness of the electrical component, a variable space may be formed in the electronic device when the thickness of the electrical component is decreased. In the case where there is no component for reducing vibration, a single variable space may be formed, and vibration with high intensity may be caused by the single variable space.

[5] Furthermore, in the case where spaces in which air is present in the electronic device are connected, the air may vibrate in a single mass, and therefore the vibration may be intensified. In this case, the vibration caused by the air in the electronic device may be increased to affect output sounds. [6] Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide an electronic device including a vibration damping member for preventing vibration of an electrical component in the electronic device and reducing vibration caused by air in the electronic device.

Solution to Problem

[7] In accordance with an aspect of the disclosure, an electronic device includes a

housing including a front plate that forms a first surface, a back plate that forms a second surface, and a side member that forms a side surface surrounding a space between the first surface and the second surface, a sound output device disposed in the housing, an electrical component that is disposed in the housing and that has a variable thickness, and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate, the vibration damping member being disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component, in which the vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

[8] In accordance with another aspect of the disclosure, an electronic device includes a housing including a front plate that forms a first surface, a back plate that forms a second surface, and a side member that forms a side surface surrounding a space between the first surface and the second surface, a sound output device disposed in the housing, an electrical component that is disposed in the housing to form a variable space with the back plate and that has a variable thickness, and a vibration damping member disposed on at least part of the electrical component or disposed in the variable space, in which the vibration damping member has a plurality of folds that cause the vibration damping member to be folded in the variable space and divides the variable space into a plurality of sub- spaces while being folded along the plurality of folds, when the variable space has a specified thickness or more.

[9] In accordance with another aspect of the disclosure, an electronic device includes a housing including a front plate that forms a first surface, a back plate that forms a second surface, and a side member that forms a side surface surrounding a space between the first surface and the second surface, a sound output device disposed in the housing, an electrical component that is disposed in the housing to form a variable space with the back plate and that has a variable thickness, and a vibration damping member disposed on at least part of the electrical component or disposed in the variable space, in which the vibration damping member is disposed such that at least part thereof makes contact with the electrical component or the back plate, and when the variable space has a specified thickness or more, the vibration damping member divides the variable space into a plurality of sub- spaces while making contact with the electrical component and the back plate at a plurality of points.

Advantageous Effects of Invention

[10] According to the embodiments of the disclosure, when the thickness of the variable space formed between the electrical component in the electronic device and the back plate is varied, the heights of the vibration damping members may be varied in the thickness direction of the variable space to correspond to the varied thickness. Even though the thickness of the variable space is varied by the electrical component having a variable thickness, the vibration damping members may maintain the state of being attached to the electrical component, thereby preventing vibration of the electrical component.

[11] Furthermore, according to the embodiments of the disclosure, the vibration damping members may be deformed to divide the variable space formed in the electronic device. When air in the electronic device vibrates in the divided variable space, the vibration caused by the air may be divided, and the amplitude of the vibration caused by the air may be decreased.

[12] In addition, the disclosure may provide various effects that are directly or indirectly recognized.

Brief Description of Drawings

[13] FIG. 1 illustrates a front perspective view of a mobile electronic device according to an embodiment;

[14] FIG. 2 illustrates a rear perspective view of the electronic device of FIG. 1;

[15] FIG. 3 illustrates an exploded perspective view of the electronic device of FIG. 1;

[16] FIG. 4 is a view illustrating an electronic device including sound output devices according to an embodiment;

[17] FIG. 5a is a view illustrating a front plate to which an electrical component having a variable thickness is coupled according to an embodiment;

[18] FIG. 5b is a view illustrating the front plate and a back plate to which the electrical component having a variable thickness is coupled according to an embodiment;

[19] FIG. 6 is a view illustrating the electrical component and a vibration damping

member according to an embodiment;

[20] FIG. 7a is a view illustrating the electrical component and a vibration damping

member according to an embodiment;

[21] FIG. 7b is a view illustrating the electrical component and the vibration damping WO 2020/175790 PCT/KR2020/000236 member according to an embodiment;

[22] FIG. 8 is a view illustrating a vibration damping member according to an em

bodiment;

[23] FIG. 9a is a view illustrating vibration formed in a variable space by a conventional fixing member;

[24] FIG. 9b is a view illustrating vibrations in a plurality of sub-spaces formed by a vibration damping member according to an embodiment;

[25] FIG. 10a is a view illustrating a vibration damping member according to an em

bodiment;

[26] FIG. 10b is a view illustrating a folded state of the vibration damping member

according to an embodiment;

[27] FIG. 10c is a view illustrating a state in which a plurality of vibration damping

members according to an embodiment are disposed on the electrical component;

[28] FIG. 1 la is a view illustrating a vibration damping member according to an em

bodiment;

[29] FIG. 1 lb is a view illustrating a state in which a plurality of vibration damping

members according to an embodiment are disposed on the electrical component;

[30] FIG. 12a is a view illustrating a state in which a plurality of expansion parts

according to an embodiment are disposed on the electrical component;

[31] FIG. 12b is a view illustrating the plurality of expansion parts according to an em bodiment;

[32] FIG. 12c is a view illustrating the plurality of expansion parts according to an em bodiment;

[33] FIG. 12d is a view illustrating a plurality of expansion parts according to an em bodiment;

[34] FIG. 12e is a view illustrating a plurality of expansion parts according to an em bodiment;

[35] FIG. 13a is a view illustrating a state in which a plurality of directional members according to an embodiment are disposed on the electrical component;

[36] FIG. 13b is a view illustrating the plurality of directional members according to an embodiment;

[37] FIG. 13c is a view illustrating the plurality of directional members according to an embodiment; and

[38] Fig. 14 is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[39] With regard to the description of the drawings, identical or similar reference

numerals may be used to refer to identical or similar components. Mode for the Invention

[40] Referring to FIGS. 1 and 2, an electronic device 100 according to an embodiment may include a housing 110 that includes a first surface (or a front surface) 110a, a second surface (or a rear surface) 110b, and side surfaces 110c that surround a space between the first surface 110a and the second surface 110b. In an embodiment, a housing may refer to a structure that forms some of the first surface 110a, the second surface 110b, and the side surfaces 110c of FIG. 1. According to an embodiment, the first surface 110a may be formed by a front plate 102, at least a portion of which is substantially transparent (e.g., a glass plate or a polymer plate that includes various coating layers). The second surface 110b may be formed by a back plate 111 that is substantially opaque. The back plate 111 may be formed of, for example, coated or colored glass, ceramic, a polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two thereof. The side surfaces 110c may be formed by a side bezel structure (or a "side member") 118 that is coupled with the front plate 102 and the back plate 111 and that contains metal and/or a polymer. In some embodiments, the back plate 111 and the side bezel structure 118 may be integrally formed with each other and may contain the same material (e.g., a metallic material such as aluminum).

[41] In the illustrated embodiment, the front plate 102 may include, at opposite long edges thereof, two first areas 110D that curvedly and seamlessly extend toward the back plate 111 from the first surface 110a. In the illustrated embodiment (refer to FIG. 2), the back plate 111 may include, at opposite long edges thereof, two second areas 110E that curvedly and seamlessly extend toward the front plate 102 from the second surface

110b. In some embodiments, the front plate 102 (or the back plate 111) may include one of the first areas 110D (or the second areas 110E). In an embodiment, a part of the first areas 110D or the second areas 110E may not be included. In the embodiments, when viewed from a side of the electronic device 100, the side bezel structure 118 may have a first thickness (or width) at sides not including the first areas 110D or the second areas 110E and may have a second thickness smaller than the first thickness at sides including the first areas 110D or the second areas 110E.

[42] According to an embodiment, the electronic device 100 may include at least one of a display 101, audio modules 103, 107, and 114, sensor modules 104, 116, and 119, camera modules 105, 112, and 113, key input devices 117, a light emitting element 106, and connector holes 108 and 109. In some embodiments, the electronic device 100 may omit at least one component (e.g., the key input devices 117 or the light emitting element 106) among the aforementioned components, or may additionally include other component(s). [43] The display 101 may be exposed through, for example, a large portion of the front plate 102. In some embodiments, at least part of the display 101 may be exposed through the front plate 102 that forms the first surface 110a and the first areas 110D of the side surfaces 110c. In some embodiments, the edge of the display 101 may be formed to be substantially the same as the shape of the adjacent periphery of the front plate 102. In an embodiment, the gap between the periphery of the display 101 and the periphery of the front plate 102 may be substantially constant to expand the area by which the display 101 is exposed.

[44] In an embodiment, recesses or openings may be formed in a portion of a screen

display area of the display 101, and the electronic device 100 may include at least one of the audio module 114, the sensor module 104, the camera module 105, and the light emitting element 106 that are aligned with the recesses or the openings. In an em bodiment, the electronic device 100 may include, on a rear surface of the screen display area of the display 101, at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106. In an embodiment, the display 101 may be combined with, or disposed adjacent to, touch detection circuitry, a pressure sensor for measuring the intensity (pressure) of a touch, and/or a digitizer for detecting a stylus pen of a magnetic type. In some embodiments, at least a part of the sensor modules 104 and 119 and/or at least a part of the key input devices 117 may be disposed in the first areas 110D and/or the second areas 110E.

[45] The audio modules 103, 107, and 114 may include the microphone hole 103 and the speaker holes 107 and 114. A microphone for obtaining a sound from the outside may be disposed in the microphone hole 103, and in some embodiments, a plurality of mi crophones may be disposed in the microphone hole 103 to sense the direction of a sound. The speaker holes 107 and 114 may include the external speaker hole 107 and the receiver hole 114 for a telephone call. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented with one hole, and a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 107 and 114.

[46] The sensor modules 104, 116, and 119 may generate an electrical signal or a data value that corresponds to an operational state inside the electronic device 100 or an en vironmental state external to the electronic device 100. The sensor modules 104, 116, and 119 may include, for example, the first sensor module 104 (e.g., a proximity sensor) and/or the second sensor module (e.g., a fingerprint sensor) that is disposed on the first surface 110a of the housing, and/or the third sensor module 119 (e.g., an HRM sensor) and/or the fourth sensor module 116 (e.g., a fingerprint sensor) that is disposed on the second surface 110b of the housing 110. The fingerprint sensor may be disposed not only on the first surface 110a of the housing 110 (e.g., the display 101) but also on the second surface 110b. The electronic device 100 may further include a non-il- lustrated sensor module, which may be, for example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or the illuminance sensor 104.

[47] The camera modules 105, 112, and 113 may include the first camera device 105 disposed on the first surface 110a of the electronic device 100, and the second camera device 112 and/or the flash 113 disposed on the second surface 110b. The camera devices 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an IR camera lens, a wide angle lens, and a telephoto lens) and image sensors may be disposed on one surface of the electronic device 100.

[48] The key input devices 117 may be disposed on the side surfaces 110c of the housing 110. In an embodiment, the electronic device 100 may not include all or some of the aforementioned key input devices 117, and the key input devices 117 not included may be implemented in different forms such as soft keys on the display 101. In some em bodiments, the key input devices 117 may include the sensor module 116 disposed on the second surface 110b of the housing 110.

[49] The light emitting element 106 may be disposed on, for example, the first surface 110a of the housing 110. The light emitting element 106 may provide, for example, state information of the electronic device 100 in the form of light. In an embodiment, the light emitting element 106 may provide, for example, a light source that operates in conjunction with the camera module 105. The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[50] The connector holes 108 and 109 may include the first connector hole 108 in which a connector (e.g., a USB connector) for transmitting and receiving power and/or data with an external electronic device is received, and/or the second connector hole 109 (e.g., an earphone jack) in which a connector for transmitting and receiving audio signals with an external electronic device is received.

[51] Referring to FIG. 3, an electronic device 300 may include a side bezel structure 310, a first support member 311 (e.g., a bracket), a front plate 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a back plate 380. In some embodiments, the electronic device 300 may omit at least one component (e.g., the first support member 311 or the second support member 360) among the aforementioned components, or may additionally include other component(s). At least one of the components of the electronic device 300 may be the same as, or similar to, at least one of the components of the electronic device 100 of FIG. 1 or FIG. 2, and repetitive descriptions will hereinafter be omitted.

[52] The first support member 311 may be disposed in the electronic device 300 and may be connected with the side bezel structure 310, or may be integrally formed with the side bezel structure 310. The first support member 311 may be formed of, for example, a metallic material and/or a nonmetallic (e.g., polymer) material. The first support member 311 may have one surface to which the display 330 is coupled and an opposite surface to which the printed circuit board 340 is coupled. The printed circuit board 340 may have a processor, a memory, and/or an interface mounted thereon. The processor may include one or more of, for example, a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[53] The memory may include, for example, a volatile memory or a nonvolatile memory.

[54] The interface may include, for example, a high definition multimedia interface

(HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface, for example, may electrically or physically connect the electronic device 300 with an external electronic device and may include a USB connector, an SD card/MMC connector, or an audio connector.

[55] The battery 350 may be a device for supplying power to at least one component of the electronic device 300 and may include, for example, a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell. For example, at least part of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340. The battery 350 may be integrally disposed in the electronic device 300 and may be disposed so as to be detachable from the electronic device 300.

[56] The antenna 370 may be disposed between the back plate 380 and the battery 350.

The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform short range communication with an external device, or may wirelessly transmit and receive power used for charging. In an embodiment, an antenna structure may be formed by the side bezel structure 310 and/or part of the first support member 311, or a combination thereof.

[57] FIG. 4 is a view 400 illustrating an electronic device (e.g., the electronic device 100 of FIG. 1) that includes sound output devices 410 and 421 according to an em bodiment.

[58] In an embodiment, the electronic device 100 may have the sound output devices 410 and 421 mounted therein. The sound output devices 410 and 421 may be referred to as the sound parts. When the sound output devices 410 and 421 are operated or played, air in the sound output devices 410 and 421 and the electronic device 100 may be vibrated by output sounds. When the air in the electronic device 100 vibrates, electrical components in the electronic device 100 may vibrate.

[59] In an embodiment, the sound output devices 410 and 421 may be dynamic speakers.

When the dynamic speakers are played, vibration of air may be transmitted to the interior of the electronic device 100, which is a mounting portion on the opposite side to sound outlets, due to vertical motion of vibration plates of the dynamic speakers.

The exterior of the product may be shaken due to the vibration of air that is generated in the interior space of the electronic device 100. Furthermore, when the dynamic speakers make loud sounds or make sounds at high output levels, a low- stiffness portion of the electronic device 100 or an electrical component may be intensively vibrated.

[60] In an embodiment, the sound output devices 410 and 421 may be separately mod ularized and implemented as sound modules 420. However, a compact electronic device, or an electronic device including complex technologies may lack a space for mounting the sound modules 420 implemented by modularizing the sound output devices 410 and 421. Furthermore, in the case where the dynamic speakers are mod ularized in a small size, the performance may be degraded due to the compression re sistance of air in the sound modules 420.

[61] In an embodiment, the electronic device 100 may be designed to release, to the

outside, vibration of air that is generated in the sound output devices 410 and 421. When an air flow generated in the dynamic speakers is released outside the electronic device 100, vibration generated in the electronic device 100 may be reduced. However, in the case of the electronic device 100 that fails to rapidly reach pressure equilibrium between the inside and the outside of the electronic device 100 due to design of a wa terproof structure, an air flow may be restricted, and therefore vibration reduction may not be easy.

[62] In an embodiment, to prevent vibration of the electrical component, the electrical component that vibrates may be fixed by a fixing member having a force stronger than the vibration force. For example, vibration may be reduced by fixing a vibrating area in the electronic device 100 with a fixing member, such as a tape or sponge, or by strengthening the material stiffness of the electronic device 100. However, it may be difficult to relocate the fixing member, and the thickness of the electronic device 100 may be increased.

[63] FIG. 5a is a view 500 illustrating the front plate 320 to which the electrical

component 350 having a variable thickness is coupled according to an embodiment. FIG. 5b is a view 550 illustrating the front plate 320 and the back plate 380 to which the electrical component 350 having a variable thickness is coupled according to an embodiment. [64] In an embodiment, the electrical component 350 may have a greater variation in thickness than other components in the electronic device. The electrical component 350 may have a specified thickness tolerance or more. The thickness of the electrical component 350 may vary depending on a usage status and/or a usage condition of the electronic device.

[65] In an embodiment, the electrical component 350 may be the battery 350. The

thickness of the battery 350 may vary depending on a charging status. When the amount of charge of the battery 350 increases, the thickness of the battery 350 may increase, and when the amount of charge of the battery 350 decreases, the thickness of the battery 350 may decrease. For example, depending on the amount of charge of the battery 350, the thickness of the battery 350 may have a greater variation than a fixing member (e.g., a tape or sponge) of the battery 350.

[66] In an embodiment, depending on the internal structure, the thicknesses of the battery 350 may be different for respective positions, and thickness variations may also be different. For example, referring to FIG. 5a, the left portion of the battery 350 may have a first thickness Tl, and the thickness of the left portion may increase by a first variation DH1 during charging, compared with during discharging. In another example, the central portion of the battery 350 may have a second thickness T2 greater than the first thickness Tl, and the thickness of the central portion may increase by a second variation DH2 greater than the first variation DH1 during charging, compared with during discharging. In another example, the right portion of the battery 350 may have a third thickness T3 greater than the second thickness T2, and the thickness of the right portion may increase by a third variation DH3 greater than the second variation DH2 during charging, compared with during discharging.

[67] In an embodiment, the thickness or gap of a variable space formed between the

battery 350 and the back plate 380 may also vary depending on the thickness of the battery 350. In the case where the thicknesses of the battery 350 are different for re spective positions, the thicknesses of the variable space may also be different for the respective positions. For example, referring to FIG. 5b, the left portion of the back plate 380 may have a first gap Gl, the central portion of the back plate 380 may have a second gap G2, and the right portion of the back plate 380 may have a third gap G3.

[68] Because the thickness of the battery 350 varies depending on the thickness tolerance and the charging status, it may not be easy to fix the battery 350 that is vibrated by a sound output device. The battery 350 is characterized in that the thickness tolerance is large depending on the structure of the battery 350 and the thickness varies depending on the charging status, and therefore it may not be easy to design a structure for reducing vibration.

[69] A problem may be encountered when the fixing member is disposed to overlap the battery 350 by a specified thickness. For example, in the case where a thin fixing member is disposed based on a large thickness caused by a large amount of charge of the battery 350 so as to prevent a thickness variation of the electronic device, vibration may be decreased when the battery 350 has a large thickness, but vibration may occur due to the gap of the variable space between the battery 350 and the back plate 380 in the electronic device when the battery 350 has a small thickness due to a small amount of charge of the battery 350. In another example, in the case where a thick fixing member is disposed based on a small thickness caused by a small amount of charge of the battery 350 so as to remove an inner gap, vibration may be decreased even when the battery 350 has a small thickness, but expansion pressure may be generated in the housing of the electronic product to cause the housing to be unfastened or inflated when the battery 350 has a large thickness.

[70] Hereinafter, methods for reducing vibration of the electrical component in a playback condition of a sound output device will be described with reference to FIG. 6 and the following drawings. In particular, structures for reducing vibration of the electrical component, the thickness of which varies depending on a usage status or a usage condition, will be presented.

[71] FIG. 6 is a view 600 illustrating the electrical component and a vibration damping member 610 according to an embodiment. FIG. 6 illustrates an example that the electrical component is the battery 350. Without being limited thereto, however, the electrical component may be a component that has a thickness varying depending on a usage status or a usage condition and that is provided in the variable space of the electronic device.

[72] In an embodiment, the vibration damping member 610 may be disposed on one side of the battery 350. The vibration damping member 610 may divide the variable space between the battery 350, which is subject to vibration, and the back plate (e.g., the back plate 380 of FIG. 5b) into a plurality of sub-spaces. The vibration damping member 610 may divide air contained in the variable space between the battery 350 and the back plate 380, the air being a medium for transmitting vibration. The vibration damping member 610 may reduce vibration caused by the battery 350 and the back plate 380.

[73] In an embodiment, depending on the thickness of the variable space formed in the electronic device (e.g., the electronic device 300), the vibration damping member 610 may divide the variable space, or may not divide the variable space. The vibration damping member 610 may have a variable sheet structure capable of selectively dividing the variable space depending on a variation in the variable space.

[74] In an embodiment, the vibration damping member 610 may have a plurality of folds 611 and 612 that cause the vibration damping member 610 to be folded or bent in the variable space. Folding directions may be preset by the plurality of folds 611 and 612. Depending on the folding directions of the folds 611 and 612, the vibration damping member 610 may be folded toward, or away from, the battery 350.

[75] In an embodiment, the plurality of folds 611 and 612 may include the first folds 611 and the second folds 612. The first folds 611 may cause the vibration damping member 610 to be folded to protrude in a first direction (e.g., a first direction D1 of FIG. 7a) toward the first surface in the variable space. The second folds 612 may cause the vibration damping member 610 to be folded to protrude in a second direction (e.g., a second direction D2 of FIG. 7a) that is opposite to the first direction Dl.

[76] In an embodiment, the first folds 611 and the second folds 612 may be alternately disposed on the vibration damping member 610. The first folds 611 and the second folds 612 may be alternately disposed such that the folding directions of folds adjacent to each other are different from each other.

[77] In an embodiment, the vibration damping member 610 may divide the volume of air in the variable space that is a medium for transmitting vibration. When the variable space has a specified thickness or more, the vibration damping member 610 may divide the variable space into a plurality of sub-spaces. When the thickness of the variable space is less than the specified thickness, the vibration damping member 610 may be unfolded so as not to substantially occupy a volume. When the thickness of the variable space is less than the specified thickness, the vibration damping member 610 may prevent the back plate 380 from being pushed rearward, or may prevent pressure from being applied to the portion on which the battery 350 is mounted.

[78] FIG. 7a is a view 700 illustrating the electrical component (e.g., the battery 350) and the vibration damping member 610 according to an embodiment. FIG. 7b is a view 750 illustrating the electrical component 350 and the vibration damping member 610 according to an embodiment.

[79] In an embodiment, the electrical component 350 may be disposed in the housing. The electrical component 350 may have a thickness varying depending on a usage status or a usage condition.

[80] In an embodiment, the vibration damping member 610 may be disposed on at least part of the electrical component 350. The vibration damping member 610 may be disposed on one surface of the electrical component 350. The vibration damping member 610 may be disposed in the variable space formed by the electrical component 350 and the back plate 380. The vibration damping member 610 may be disposed such that at least part thereof makes contact with the electrical component 350 and the back plate 380.

[81] In an embodiment, the vibration damping member 610 may have a height varying in the thickness direction of the variable space to correspond to the thickness of the variable space formed by the electrical component 350 and the back plate 380. For example, in FIG. 7a, the vibration damping member 610 may vary in height to have a first height HI that is the same as the thickness of the variable space. In another example, in FIG. 7b, the vibration damping member 610 may vary in height to have a second height H2 that is the same as the thickness of the variable space.

[82] In an embodiment, when the variable space has a specified thickness or more, the vibration damping member 610 may divide the variable space into a plurality of sub spaces. For example, when the variable space has the first height HI that is greater than or equal to the specified thickness, the vibration damping member 610 may divide the variable space into the plurality of sub-spaces.

[83] In an embodiment, the vibration damping member 610 may have first protrusions 710 and second protrusions 720. The first protrusions 710 may protrude in the first direction Dl. The first protrusions 710 may make contact with the electrical component 350. The second protrusions 720 may protrude in the second direction D2. The second protrusions 720 may make contact with the back plate 380.

[84] In an embodiment, the height difference between the first protrusions 710 and the second protrusions 720 may be substantially the same as the thickness of the variable space. For example, in FIG. 7a, the height of the first protrusions 710 in the first direction Dl and the height of the second protrusions 720 in the second direction D2 may be substantially the same as the first height HI.

[85] In an embodiment, when the variable space has the specified thickness or more, the vibration damping member 610 may divide the variable space into the plurality of sub spaces while being folded along a plurality of folds (e.g., the first folds 611 and the second folds 612 of FIG. 6). For example, as illustrated in FIG. 7a, when the variable space has the first height HI that is greater than or equal to the specified thickness, the vibration damping member 610 may divide the variable space in a triangular-wave form while being folded along the plurality of folds 611 and 612.

[86] In an embodiment, when the variable space has the specified thickness or more, the vibration damping member 610 may divide the variable space into the plurality of sub spaces while making contact with the electrical component 350 and the back plate 380 at a plurality of points. For example, as illustrated in FIG. 7a, when the variable space has the first height HI that is greater than or equal to the specified thickness, the vibration damping member 610 may divide the variable space in a triangular-wave form while making contact with the electrical component 350 and the back plate 380 at the plurality of points alternating with one another.

[87] In an embodiment, the thickness of the variable space may vary complementarily to a thickness variation of the electrical component 350. A thickness variation of the variable space may be greater than the thickness of the vibration damping member 610. The vibration damping member 610 may cope with the thickness variation of the variable space while changing the form using the plurality of folds 611 and 612.

[88] In an embodiment, when the thickness of the variable space is less than the specified thickness, the vibration damping member 610 may be disposed to make surface- to-surface contact with the electrical component 350 and the back plate 380. For example, as illustrated in FIG. 7b, when the variable space has the second height H2 that is less than the specified thickness, the vibration damping member 610 may be disposed in a plate form to make surface-to-surface contact with both the electrical component 350 and the back plate 380.

[89] In an embodiment, when the thickness of the variable space is less than the specified thickness, the vibration damping member 610 may be unfolded using the plurality of folds 611 and 612. The plurality of folds 611 and 612 may cause the vibration damping member 610 to be unfolded between the electrical component 350 and the back plate 380.

[90] In an embodiment, when the thickness of the variable space is less than the specified thickness, the vibration damping member 610 may be disposed to entirely make contact with the electrical component 350 and the back plate 380. The vibration damping member 610 may be disposed so as not to substantially occupy a volume in the variable space.

[91] In an embodiment, the vibration damping member 610 may be deformed to have different heights so as to correspond to the thicknesses of the variable space for re spective areas. For example, the thickness of the electrical component 350 may be non- uniformly varied, and therefore the variable space may have a thickness corresponding to the first height HI in one area and a thickness corresponding to the second height H2 in the remaining area. In this case, in the one area, the vibration damping member 610 may have the first height HI and may divide the variable space into a plurality of sub-spaces, and in the remaining area, the vibration damping member 610 may have the second height H2 and may be deformed into a flat state.

[92] FIG. 8 is a view illustrating the vibration damping member 610 according to an em bodiment.

[93] In an embodiment, the vibration damping member 610 may have the first protrusions 710 and the second protrusions 720. The first protrusions 710 and the second pro trusions 720 may protrude in opposite directions. For example, the first protrusions 710 may be disposed to protrude in the first direction D1 toward the electrical component (e.g., the battery 350 of FIG. 7a) in the variable space, and the second protrusions 720 may be disposed to protrude in the second direction D2 opposite to the first direction Dl. The vibration damping member 610 may have a plurality of folds (e.g., the first folds 611 and the second folds 612 of FIG. 6) for forming the first protrusions 710 and the second protrusions 720. The plurality of folds 611 and 612 may have restoring power to fill the variable space between the electrical component (e.g., the electrical component 350 of FIG. 7a) and the back plate (e.g., the back plate 380 of FIG. 7a).

[94] In an embodiment, the vibration damping member 610 may have a form that is bent in a triangular-wave form. The vibration damping member 610 may have a zigzag form in the first direction D1 and the second direction D2. The vibration damping member 610 may divide the variable space adjacent to the vibration damping member 610 in a triangular-wave form.

[95] In an embodiment, the vibration damping member 610 may have different forms in at least a partial area. The length of the vibration damping member 610 in the first direction D1 may partially vary to correspond to a thickness variation of the electrical component 350. For example, when the thickness of the variable space decreases in a partial area in which the electrical component 350 has a large thickness, the vibration damping member 610 may decrease the degree to which the first protrusions 710 and the second protrusions 720 protrude in the partial area. In another example, when the thickness of the variable space increases in a partial area in which the electrical component 350 has a small thickness, the vibration damping member 610 may increase the degree to which the first protrusions 710 and the second protrusions 720 protrude in the partial area.

[96] FIG. 9a is a view 900 illustrating vibration formed in a variable space 901 by a con ventional fixing member 601.

[97] The conventional fixing member 601 may be integrally disposed on the electrical component 350. The variable space 901 may be left undivided by the fixing member 601. When sound output devices (e.g., the sound output devices 410 and 421 of FIG.

4) output sounds, the variable space 901 formed by the fixing member 601 may in tegrally vibrate. The variable space 901, when integrally vibrating, may transmit vi brations generated from the sound output devices with a first amplitude Al.

[98] FIG. 9b is a view 950 illustrating vibrations in a plurality of sub-spaces 911, 912,

913, and 914 formed by the vibration damping member 610 according to an em bodiment.

[99] In an embodiment, at least part of the vibration damping member 610 may be

disposed on the electrical component 350. The vibration damping member 610 may divide the variable space (e.g., the variable space 901 of FIG. 9a) using the plurality of folds 611 and 612 to form the plurality of sub-spaces 911, 912, 913, and 914. For example, the vibration damping member 610 may form the first to fourth sub-spaces 911, 912, 913, and 914 using the first and second folds 611 and 612. When the sound output devices 410 and 421 output sounds, the first to fourth sub-spaces 911, 912, 913, and 9124 formed by the vibration damping member 610 may vibrate in the divided state. The first to fourth sub-spaces 911, 912, 913, and 914, when vibrating in the divided state, may transmit the vibrations with a second amplitude A2 smaller than the first amplitude (e.g., the first amplitude A1 of FIG. 9a).

[100] FIG. 10a is a view 1000 illustrating a vibration damping member 1010 according to an embodiment. FIG. 10b is a view illustrating a folded state of the vibration damping member 1010 according to an embodiment.

[101] In an embodiment, the vibration damping member 1010 may have a plurality of folds 1011 and 1012. The plurality of folds 1011 and 1012 may be formed in a direction different from that of the plurality of folds 611 and 612 of FIG. 6. For example, as il lustrated in FIG. 10a, the plurality of folds 1011 and 1012 may be formed in the direction toward the left side and/or the right side of the vibration damping member 1010.

[102] In an embodiment, the plurality of folds 1011 and 1012 may cause the vibration

damping member 1010 to be folded. The plurality of folds 1011 and 1012 may cause the vibration damping member 1010 to at least partially protrude in the first direction D1 or the second direction D2. The plurality of folds 1011 and 1012 may cause the vibration damping member 1010 to be bent in a zigzag form.

[103] FIG. 10c is a view 1050 illustrating a state in which a plurality of vibration damping members 1010_ 1 and 1010_2 according to an embodiment are disposed on the electrical component 350.

[104] In an embodiment, the plurality of vibration damping members 1010_ 1 and 1010_2 may be disposed on the electrical component 350. For example, the first and second vibration damping members 1010_ 1 and 1010_2 may be disposed on the electrical component 350. The first and second vibration damping members 1010_ 1 and 1010_2 may be substantially the same as the vibration damping member 1010 of FIG. 10a. The first and second vibration damping members 1010_ 1 and 1010_2 may be spaced apart from each other. The first and second vibration damping members 1010_ 1 and 1010_2 may be disposed adjacent to each other. A plurality of folds 1011, 1012, 1021, and 1022 may be disposed on the first and second vibration damping members 1010_ 1 and 1010_2.

[105] In an embodiment, among the plurality of folds 1011, 1012, 1021, and 1022, at least some folds 1011 and 1012 may be disposed to face toward a first edge El among the edges of the electrical component 350, and the remaining folds 1021 and 1022 may be disposed to face toward a second edge E2 that meets the first edge El. For example, the folds 1011 and 1012 disposed on the first vibration damping member 1010_ 1 may be disposed to face toward the first edge El, and the folds 1021 and 1022 disposed on the second vibration damping member 1010_2 may be disposed to face toward the second edge E2. Accordingly, protrusions may be formed in different directions for re- spective areas of the electrical component 350 to divide the variable space on the electrical component 350.

[106] In FIG. 10c, it is exemplified that the plurality of vibration damping members

1010_ 1 and 1010_2 are all attached to the electrical component 350. Without being limited thereto, however, the plurality of vibration damping members 1010_ 1 and 1010_2 may be disposed to overlap each other on the electrical component 350. For example, one vibration damping member 1010_ 1 may be attached to the electrical component 350, and another vibration damping member 1010_2 may be stacked on and/or attached to the one vibration damping member 1010_ 1 in a separate sheet form. Even when the vibration damping members 1010_ 1 and 1010_2 overlap each other, the vibration damping members 1010_ 1 and 1010_2 may divide the variable space between the electrical component 350 and the back plate (e.g., the back plate 380 of FIG. 7a) into a plurality of sub-spaces. Furthermore, when the vibration damping members 1010_ 1 and 1010_2 are attached to overlap each other, work efficiency in attaching the vibration damping members 1010_ 1 and 1010_2 may be improved.

[107] FIG. 1 la is a view 1110 illustrating a vibration damping member 1110 according to an embodiment.

[108] In an embodiment, the vibration damping member 1110 may include first curved portions 1111 and second curved portions 1112. The first curved portions 1111 may be convex in the first direction D1 toward the electrical component (e.g., the electrical component 350 of FIG. 10c) in the variable space. The second curved portions 1112 may be convex in the second direction D1 opposite to the first direction Dl.

[109] In an embodiment, the heights of the first curved portions 1111 and the second

curved portions 1112 may be varied to be substantially the same as the height of the variable space. The heights of the first curved portions 1111 and the second curved portions 1112 may be varied to correspond to the height of the variable space. When the thickness of the variable space increases, the heights of the first curved portions 1111 and the second curved portions 1112 may increase to prevent a gap from being generated. The variable space on the electrical component 350 may be divided into a plurality of sub-spaces by the vibration damping member 1110. When the variable space is divided into the plurality of sub-spaces, vibration intensity may be reduced. Furthermore, when the thickness of the variable space decreases, the heights of the first curved portions 1111 and the second curved portions 1112 may decrease, and the first curved portions 1111 and the second curved portions 1112 may press the electrical component 350 to prevent generation of internal pressure.

[110] In an embodiment, the variable space may be divided depending on the first curved portions 1111 and the second curved portions 1112. When the variable space has a specified thickness or more, the variable space may be divided into a plurality of sub- spaces having the form of a portion of a sinusoidal wave. When vibrations generated from sound output devices (e.g., the sound output devices 410 and 421 of FIG. 4) are transmitted through air in the plurality of sub- spaces into which the first curved portions 1111 and the second curved portions 1112 divide the variable space, vibration of the electrical component 350 may be reduced.

[111] FIG. 1 lb is a view 1150 illustrating a state in which a plurality of vibration damping members 1110_ 1 and 1110_2 according to an embodiment are disposed on the electrical component 350.

[112] In an embodiment, the plurality of vibration damping members 1110_ 1 and 1010_2 may be disposed on the electrical component 350. For example, the third and fourth vibration damping members 1110_1 and 1110_2 may be disposed on the electrical component 350. The third and fourth vibration damping members 1110_1 and 1110_2 may be substantially the same as the vibration damping member 1110 of FIG. 1 la. The third and fourth vibration damping members 1110_ 1 and 1110_2 may be spaced apart from each other. The third and fourth vibration damping members 1110_ 1 and 1110_2 may be disposed adjacent to each other. A plurality of folds 1121, 1122, 1131, and

1132 may be disposed on the third and fourth vibration damping members 1110_1 and

1110_2.

[113] In an embodiment, the third vibration damping member 1110_ 1 may include the third folds 1121 and the fourth folds 1122, and the fourth vibration damping member

1110_2 may also include the third folds 1131 and the fourth folds 1132. The third folds 1121 and 1131 may cause the third and fourth vibration damping members 1110_ 1 and 1110_2 to be convex in the first direction (e.g., the first direction D1 of FIG. 1 la) toward the electrical component 350 in the variable space. The fourth folds 1122 and 1132 may cause the third and fourth vibration damping members 1110_1 and 1110_2 to be convex in the second direction D2 opposite to the first direction Dl.

[114] In an embodiment, a plurality of third and fourth vibration damping members 1110_ 1 and 1110_2 may be disposed on the electrical component 350, and the third folds 1121 and 1131 and the fourth folds 1122 and 1132 may be disposed to alternate with one another on the plurality of third and fourth vibration damping members 1110_ 1 and

1110_2. For example, the third fold 1121 of the third vibration damping member 1110_ 1 and the fourth fold 1132 of the fourth vibration damping member 1110_2 may be disposed on a straight line, and the fourth fold 1122 of the third vibration damping member 1110_ 1 and the third fold 1131 of the fourth vibration damping member 1110_2 may be disposed on a straight line.

[115] In an embodiment, the third and fourth vibration damping members 1110_1 and

1110_2 may be substantially the same as one of the vibration damping member 610 of FIG. 8 and the vibration damping member 1110 of FIG. 1 la. Accordingly, the third and fourth vibration damping members 1110_1 and 1110_2 may have different forms. For example, the third vibration damping member 1110_1 may be substantially the same as the vibration damping member 610 of FIG. 8 and may have a triangular-wave form with the protrusions 710 and 720, and the fourth vibration damping member 1110_2 may be substantially the same as the vibration damping member 1110 of FIG.

1 la and may have a sinusoidal-wave form with the curved portions 1111 and 1112.

[116] FIG. 12a is a view 1200 illustrating a state in which a plurality of expansion parts 1210, 1220, and 1230 according to an embodiment are disposed on the electrical component 350. FIG. 12b is a view illustrating the plurality of expansion parts 1210, 1220, and 1230 according to an embodiment. FIG. 12c is a view illustrating the plurality of expansion parts 1210, 1220, and 1230 according to an embodiment. FIG. 12d is a view illustrating a plurality of expansion parts 1240, 1250, and 1260 according to an embodiment. FIG. 12e is a view illustrating the plurality of expansion parts 1240, 1250, and 1260 according to an embodiment.

[117] In an embodiment, a vibration damping member may include the plurality of

expansion parts 1210, 1220, and 1230. In the variable space, the plurality of expansion parts 1210, 1220, and 1230 may expand in the first direction D1 toward the electrical component 350 and the second direction D2 opposite to the first direction Dl. When the thickness of the variable space is increased due to a small thickness of the electrical component 350, the thicknesses of the plurality of expansion parts 1210, 1220, and 1230 may be increased to divide the variable space. When the thickness of the variable space is decreased due to a large thickness of the electrical component 350, the thicknesses of the plurality of expansion parts 1210, 1220, and 1230 may be decreased. The plurality of expansion parts 1210, 1220, and 1230 may have a shape like an air pocket.

[118] In an embodiment, when the thickness of the variable space is decreased due to a large thickness of the electrical component 350, the thicknesses of the plurality of expansion parts 1210, 1220, and 1230 may be decreased, and the plurality of expansion parts 1210, 1220, and 1230 may occupy the variable space between the electrical component 350 and the back plate (e.g., the back plate 380 of FIG. 7a) in a direction perpendicular to the first and second directions Dl and D2.

[119] In an embodiment, the plurality of expansion parts 1210, 1220, and 1230 may expand to have substantially the same height as the thickness of the variable space. For example, as illustrated in FIG. 12b, when the variable space has the first height HI, the plurality of expansion parts 1210, 1220, and 1230 may expand to have the first height HI. In another example, as illustrated in FIG. 12c, when the variable space has the second height H2, the plurality of expansion parts 1210, 1220, and 1230 may expand to have the second height H2. The plurality of expansion parts 1210, 1220, and 1230 may make surface-to-surface contact with the electrical component 350 and the back plate (e.g., the back plate 380 of FIG. 3).

[120] In an embodiment, the plurality of expansion parts 1210, 1220, and 1230 may

include a plurality of folds 1211 to 1214, 1221 to 1224, and 1231 to 1234, respectively. The plurality of expansion parts 1210, 1220, and 1230 may expand or contract to a height corresponding to the variable space by using the plurality of folds 1211 to 1214, 1221 to 1224, and 1231 to 1234.

[121] In an embodiment, the plurality of expansion parts 1210, 1220, and 1230 may

include the fifth folds 1211, 1212, 1221, 1222, 1231, and 1232 and the sixth folds 1213, 1214, 1223, 1224, 1233, and 1234, respectively. The fifth folds 1211, 1212,

1221, 1222, 1231, and 1232 may cause the vibration damping member including the plurality of expansion parts 1210, 1220, and 1230 to expand in the first direction D1 toward the electrical component 350 in the variable space. The sixth folds 1213, 1214, 1223, 1224, 1233, and 1234 may cause the vibration damping member including the plurality of expansion parts 1210, 1220, and 1230 to expand in the second direction D2 opposite to the first direction Dl.

[122] In an embodiment, the fifth folds 1211, 1212, 1221, 1222, 1231, and 1232 and the sixth folds 1213, 1214, 1223, 1224, 1233, and 1234 may be disposed to overlap each other in the first direction Dl on the vibration damping member including the plurality of expansion parts 1210, 1220, and 1230. For example, the fifth folds 1211 and 1212 included in the first expansion part 1210 among the plurality of expansion parts 1210, 1220, and 1230 may overlap the sixth folds 1213 and 1214 included in the first expansion part 1210 in the first direction Dl.

[123] In an embodiment, as illustrated in FIGS. 12b and 12c, the plurality of expansion parts 1210, 1220, and 1230 may expand or contract in a hexagonal form. Without being limited thereto, however, the plurality of expansion parts 1240, 1250, and 1260 may expand or contract in various forms. The plurality of expansion parts 1240, 1250, and 1260 may have a concave shape and may be formed of a flexible material. For example, as illustrated in FIG. 12d, the plurality of expansion parts 1240, 1250, and 1260 may expand in a semi-circular form on the electrical component 350. The plurality of expansion parts 1240, 1250, and 1260 may have the first height HI. In another example, as illustrated in FIG. 12e, the plurality of expansion parts 1240, 1250, and 1260 may expand in a rectangular form on the electrical component 350. The plurality of expansion parts 1240, 1250, and 1260 may have the first height HI.

[124] FIG. 13a is a view illustrating a state in which a plurality of directional members 1310, 1320, 1330, and 1340 according to an embodiment are disposed on the electrical component 350. FIG. 13b is a view illustrating the plurality of directional members 1310, 1320, 1330, and 1340 according to an embodiment. FIG. 13c is a view il- lustrating the plurality of directional members 1310, 1320, 1330, and 1340 according to an embodiment.

[125] In an embodiment, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed on at least part of the electrical component 350. The plurality of di rectional members 1310, 1320, 1330, and 1340 may be disposed in the variable space between the electrical component 350 and the back plate (e.g., the back plate 380 of FIG. 3). The plurality of directional members 1310, 1320, 1330, and 1340 may be disposed to face a predetermined direction. For example, as illustrated in FIG. 13a, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed across the electrical component 350 from left to right.

[126] In an embodiment, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed to have substantially the same height as the thickness of the variable space. For example, as illustrated in FIG. 13b, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed to have the first height HI in the variable space. In another example, as illustrated in FIG. 13c, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed to have the second height H2 in the variable space.

[127] In an embodiment, the plurality of directional members 1310, 1320, 1330, and 1340 may be configured to have an orientation. For example, the plurality of directional members 1310, 1320, 1330, and 1340 may be formed of a compressible material, the form of which is able to be variably changed. In another example, the plurality of di rectional members 1310, 1320, 1330, and 1340 may be formed in an incompressible structure, the direction of which is able to be changed by an external force.

[128] In an embodiment, when the variable space has a specified thickness or more, the plurality of directional members 1310, 1320, 1330, and 1340 may extend in the first direction D1 or the second direction D2 that is perpendicular to the electrical component 350. For example, as illustrated in FIG. 13b, when the variable space has the first height HI, the plurality of directional members 1310, 1320, 1330, and 1340 may extend in the first direction D1 or the second direction D2.

[129] In an embodiment, when the thickness of the variable space is less than the specified thickness, the plurality of directional members 1310, 1320, 1330, and 1340 may extend in a third direction D3 parallel to the electrical component 350. For example, as il lustrated in FIG. 13c, when the variable space has the second height H2, the plurality of directional members 1310, 1320, 1330, and 1340 may extend in the third direction D3.

[130] In an embodiment, the vibration damping members described above in relation to FIGS. 6 to 13c may be applied in a sheet form.

[131] Specifically, the vibration damping members may further include a separate base sheet that includes the electrical component 350 and/or the back plate (e.g., the back plate 380 of FIG. 7a) as a base. When the vibration damping members include the base sheet, work efficiency in attaching the vibration damping members may be improved.

[132] In another example, the vibration damping members may be integrally implemented with the electrical component 350 and/or an antenna (e.g., the antenna 370 of FIG. 3) that is mounted in the electronic device 100.

[133] An electronic device (e.g., the electronic device 100 of FIG. 1) according to various embodiments may include a housing including a front plate (e.g., the front plate 320 of FIG. 3) that forms a first surface, a back plate (e.g., the back plate 380 of FIG. 3) that forms a second surface, and a side member (e.g., the side member 118 of FIG. 1) that forms a side surface surrounding a space between the first surface and the second surface, a sound output device (e.g., the sound output device 410 or 421 of FIG. 4) that is disposed in the housing, an electrical component (e.g., the electrical component 350 of FIG. 6) that is disposed in the housing and that has a variable thickness, and a vibration damping member (e.g., the vibration damping member 610 of FIG. 6) that is disposed on at least part of the electrical component 350 or formed between the electrical component 350 and the back plate 380, the vibration damping member being disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component 350. The vibration damping member 610 may have a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and may divide the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

[134] In an embodiment, the vibration damping member 610 may include a first protrusion (e.g., the first protrusion 710 of FIG. 7a) that protrudes in a first direction (e.g., the first direction D1 of FIG. 7a) in which the vibration damping member faces toward the first surface in the variable space and a second protrusion (e.g., the second protrusion 720 of FIG. 7a) that protrudes in a second direction (e.g., the second direction D2 of FIG. 7a) that is opposite to the first direction, and a height difference between the first protrusion 710 and the second protrusion 720 may be substantially the same as the thickness of the variable space.

[135] In an embodiment, the vibration damping member 610 may be disposed such that at least one of the first protrusion 710 and the second protrusion 720 is unfolded, when the thickness of the variable space is less than the specified thickness.

[136] In an embodiment, the electronic device may further include a separate base sheet between the electrical component 350 and the back plate 380, and the base sheet may be attached to the entire surface of a structure including the electrical component 350 or the back plate 380.

[137] In an embodiment, the vibration damping member 610 capable of dividing the variable space may be laminated on and integrally implemented with the electrical component 350 depending on the variable space.

[138] In an embodiment, the vibration damping member 610 may include a first curved portion (e.g., the first curved portion 1111 of FIG. 11a) that is convex in a first direction D1 toward the electrical component in the variable space and a second curved portion (e.g., the second curved portion 1112 of FIG. 1 la) that is convex in a second direction D2 opposite to the first direction Dl. Heights of the first curved portion 1111 and the second curved portion 1112 may be varied to be substantially the same as a height of the variable space, and the variable space may be divided depending on the first curved portion 1111 and the second curved portion 1112.

[139] In an embodiment, the vibration damping member 610 may include a plurality of expansion parts (e.g., the plurality of expansion parts 1210, 1220, and 1230 of FIG.

12a) that expand in a first direction Dl toward the electrical component 350 and a second direction D2 opposite to the first direction Dl in the variable space, and the plurality of expansion parts 1210, 1220, and 1230 may expand to have substantially the same height as the thickness of the variable space and may make surface-to-surface contact with the electrical component 350 and the back plate 380.

[140] In an embodiment, the vibration damping member 610 may include a plurality of di rectional members (e.g., the plurality of directional members 1310, 1320, 1330, and 1340 of FIG. 13a) that are disposed on at least part of the electrical component 350, the plurality of directional members 1310, 1320, 1330, and 1340 may be disposed to have substantially the same height as the thickness of the variable space, the plurality of di rectional members may extend in a first direction Dl or a second direction D2 per pendicular to the electrical component 350 when the variable space has the specified thickness or more, and the plurality of directional members may extend in a third direction (e.g., the third direction D3 of FIG. 13c) parallel to the electrical component 350 when the thickness of the variable space is less than the specified thickness.

[141] An electronic device 100 according to various embodiments may include a housing including a front plate 320 that forms a first surface, a back plate 380 that forms a second surface, and a side member 118 that forms a side surface surrounding a space between the first surface and the second surface, a sound output device 410 or 421 disposed in the housing, an electrical component 350 that is disposed in the housing to form a variable space with the back plate 380 and that has a variable thickness, and a vibration damping member 610 disposed on at least part of the electrical component 350 or disposed in the variable space. The vibration damping member 610 may have a plurality of folds (e.g., the first and second folds 611 and 612 of FIG. 6) that cause the vibration damping member 610 to be folded in the variable space and may divide the variable space into a plurality of sub- spaces while being folded along the plurality of folds 611 and 612, when the variable space has a specified thickness or more.

[142] In an embodiment, the plurality of folds 611 and 612 may include a first fold 611 that causes the vibration damping member 610 to be folded to protrude in a first direction D1 toward the electrical component 350 in the variable space and a second fold 612 that causes the vibration damping member 610 to be folded to protrude in a second direction D2 opposite to the first direction Dl, and the first fold 611 and the second fold 612 may be alternately disposed on the vibration damping member 610.

[143] In an embodiment, the plurality of folds 611 and 612 may cause the vibration

damping member 610 to be unfolded, when the thickness of the variable space is less than the specified thickness.

[144] In an embodiment, among the plurality of folds (e.g., the plurality of folds 1011,

1012, 1021, and 1022 of FIG. 10c), at least some folds 1011 and 1012 may be disposed to face toward a first edge El among edges (e.g., the first and second edges El and E2 of FIG. 10c) of the electrical component 350, and the remaining folds 1021 and 1022 may be disposed to face toward a second edge E2 that meets the first edge El.

[145] In an embodiment, the plurality of folds (e.g., the plurality of folds 1121, 1122, 1131, and 1132 of FIG. 1 lb) may include a third fold 1121 or 1131 that makes the vibration damping member (e.g., the vibration damping member 1110_1 or 1110_2 of FIG. 1 lb) convex in a first direction Dl toward the electrical component 350 in the variable space and a fourth fold 1122 or 1132 that makes the vibration damping member

1110_1 or 1110_2 convex in a second direction D2 opposite to the first direction Dl, and the third fold 1121 or 1131 and the fourth fold 1122 or 1132 may be alternately disposed on the vibration damping member 1110_1 or 1110_2.

[146] In an embodiment, the vibration damping member 1110_ 1 or 1110_2 may include a plurality of vibration damping members disposed on the electrical component 350, and the third fold 1121 or 1131 and the fourth fold 1122 or 1132 may be disposed to alternate with each other on the plurality of vibration damping members.

[147] In an embodiment, the plurality of folds (e.g., the plurality of folds 1121, 1212, 1213, 1214, 1221, 1222, 1223, 1224, 1231, 1232, 1233, and 1234 of FIG. 12b) may include a fifth fold 1211, 1212, 1221, 1222, 1231, or 1232 that causes the expansion parts (e.g., the expansion parts 1210, 1220, or 1230 of FIG. 12b) to expand in a first direction Dl toward the electrical component 350 in the variable space and a sixth fold 1213, 1214, 1223, 1224, 1233, or 1234 that causes the expansion parts 1210, 1220, or 1230 to expand in a second direction D2 opposite to the first direction Dl, and the fifth fold 1211, 1212, 1221, 1222, 1231, or 1232 and the sixth fold 1213, 1214, 1223, 1224,

1233, or 1234 may be disposed to overlap each other in the first direction Dl on the expansion parts 1210, 1220, or 1230.

[148] An electronic device 100 according to various embodiments may include a housing including a front plate 320 that forms a first surface, a back plate 380 that forms a second surface, and a side member 118 that forms a side surface surrounding a space between the first surface and the second surface, a sound output device 410 or 421 disposed in the housing, an electrical component 350 that is disposed in the housing to form a variable space with the back plate 380 and that has a variable thickness, and a vibration damping member 610 disposed on at least part of the electrical component 350 or disposed in the variable space. The vibration damping member 610 may be disposed such that at least part thereof makes contact with the electrical component 350 or the back plate 380, and when the variable space has a specified thickness or more, the vibration damping member may divide the variable space into a plurality of sub-spaces while making contact with the electrical component 350 and the back plate 380 at a plurality of points.

[149] In an embodiment, an area by which the vibration damping member 610 makes contact with the electrical component 350 and the back plate 380 may be decreased with an increase in the thickness of the variable space.

[150] In an embodiment, the variable space (e.g., the variable space 910 of FIG. 9a) may transmit vibration generated from the sound output device 410 or 421 with a first amplitude (e.g., the first amplitude A1 of FIG. 9a), and the plurality of sub-spaces (e.g., the plurality of sub-spaces 911, 912, 913, and 914 of FIG. 9b) may transmit the vibration with a second amplitude (e.g., the second amplitude A2 of FIG. 9b) smaller than the first amplitude Al.

[151] In an embodiment, the vibration damping member 610 may be disposed to entirely make contact with the electrical component 350 and the back plate 380 and so as not to substantially occupy a volume in the variable space, when the thickness of the variable space is less than the specified thickness.

[152] In an embodiment, a length of the vibration damping member 610 in a first direction D1 toward the electrical component 350 may be partially varied in the variable space to correspond to a thickness variation of the electrical component 350.

[153] Fig. 14 is a block diagram illustrating an electronic device 1401 in a network en vironment 1400 according to various embodiments. Referring to Fig. 14, the electronic device 1401 in the network environment 1400 may communicate with an electronic device 1402 via a first network 1498 (e.g., a short-range wireless communication network), or an electronic device 1404 or a server 1408 via a second network 1499 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1401 may communicate with the electronic device 1404 via the server 1408. According to an embodiment, the electronic device 1401 may include a processor 1420, memory 1430, an input device 1450, a sound output device 1455, a display device 1460, an audio module 1470, a sensor module 1476, an interface 1477, a haptic module 1479, a camera module 1480, a power management module 1488, a battery 1489, a communication module 1490, a subscriber identification module(SIM) 1496, or an antenna module 1497. In some embodiments, at least one (e.g., the display device 1460 or the camera module 1480) of the components may be omitted from the electronic device 1401, or one or more other components may be added in the electronic device 1401. In some embodiments, some of the components may be im plemented as single integrated circuitry. For example, the sensor module 1476 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 1460 (e.g., a display).

[154] The processor 1420 may execute, for example, software (e.g., a program 1440) to control at least one other component (e.g., a hardware or software component) of the electronic device 1401 coupled with the processor 1420, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 1420 may load a command or data received from another component (e.g., the sensor module 1476 or the communication module 1490) in volatile memory 1432, process the command or the data stored in the volatile memory 1432, and store resulting data in non-volatile memory 1434. According to an embodiment, the processor 1420 may include a main processor 1421 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 1423 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 1421. Additionally or alternatively, the auxiliary processor 1423 may be adapted to consume less power than the main processor 1421, or to be specific to a specified function. The auxiliary processor 1423 may be implemented as separate from, or as part of the main processor 1421.

[155] The auxiliary processor 1423 may control at least some of functions or states related to at least one component (e.g., the display device 1460, the sensor module 1476, or the communication module 1490) among the components of the electronic device 1401, instead of the main processor 1421 while the main processor 1421 is in an inactive (e.g., sleep) state, or together with the main processor 1421 while the main processor 1421 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 1423 (e.g., an image signal processor or a com munication processor) may be implemented as part of another component (e.g., the camera module 1480 or the communication module 1490) functionally related to the auxiliary processor 1423.

[156] The memory 1430 may store various data used by at least one component (e.g., the processor 1420 or the sensor module 1476) of the electronic device 1401. The various data may include, for example, software (e.g., the program 1440) and input data or output data for a command related thererto. The memory 1430 may include the volatile memory 1432 or the non-volatile memory 1434.

[157] The program 1440 may be stored in the memory 1430 as software, and may include, for example, an operating system (OS) 1442, middleware 1444, or an application 1446.

[158] The input device 1450 may receive a command or data to be used by other

component (e.g., the processor 1420) of the electronic device 1401, from the outside (e.g., a user) of the electronic device 1401. The input device 1450 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[159] The sound output device 1455 may output sound signals to the outside of the

electronic device 1401. The sound output device 1455 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.

[160] The display device 1460 may visually provide information to the outside (e.g., a user) of the electronic device 1401. The display device 1460 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corre sponding one of the display, hologram device, and projector. According to an em bodiment, the display device 1460 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.

[161] The audio module 1470 may convert a sound into an electrical signal and vice versa.

According to an embodiment, the audio module 1470 may obtain the sound via the input device 1450, or output the sound via the sound output device 1455 or a headphone of an external electronic device (e.g., an electronic device 1402) directly (e.g., wiredly) or wirelessly coupled with the electronic device 1401.

[162] The sensor module 1476 may detect an operational state (e.g., power or temperature) of the electronic device 1401 or an environmental state (e.g., a state of a user) external to the electronic device 1401, and then generate an electrical signal or data value corre sponding to the detected state. According to an embodiment, the sensor module 1476 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[163] The interface 1477 may support one or more specified protocols to be used for the electronic device 1401 to be coupled with the external electronic device (e.g., the electronic device 1402) directly (e.g., wiredly) or wirelessly. According to an em bodiment, the interface 1477 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[164] A connecting terminal 1478 may include a connector via which the electronic device 1401 may be physically connected with the external electronic device (e.g., the electronic device 1402). According to an embodiment, the connecting terminal 1478 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[165] The haptic module 1479 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 1479 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[166] The camera module 1480 may capture a still image or moving images. According to an embodiment, the camera module 1480 may include one or more lenses, image sensors, image signal processors, or flashes.

[167] The power management module 1488 may manage power supplied to the electronic device 1401. According to one embodiment, the power management module 1488 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[168] The battery 1489 may supply power to at least one component of the electronic

device 1401. According to an embodiment, the battery 1489 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[169] The communication module 1490 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1401 and the external electronic device (e.g., the electronic device 1402, the electronic device 1404, or the server 1408) and performing communication via the es tablished communication channel. The communication module 1490 may include one or more communication processors that are operable independently from the processor 1420 (e.g., the application processor (AP)) and supports a direct (e.g., wired) commu nication or a wireless communication. According to an embodiment, the commu nication module 1490 may include a wireless communication module 1492 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired commu nication module 1494 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these commu nication modules may communicate with the external electronic device via the first network 1498 (e.g., a short-range communication network, such as Bluetooth ⁷ ^)] , wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 1499 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 1492 may identify and authenticate the electronic device 1401 in a communication network, such as the first network 1498 or the second network 1499, using subscriber information (e.g., inter national mobile subscriber identity (IMSI)) stored in the subscriber identification module 1496.

[170] The antenna module 1497 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 1401. According to an embodiment, the antenna module 1497 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., PCB). According to an embodiment, the antenna module 1497 may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 1498 or the second network 1499, may be selected, for example, by the com munication module 1490 (e.g., the wireless communication module 1492) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 1490 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be ad ditionally formed as part of the antenna module 1497.

[171] At least some of the above-described components may be coupled mutually and com municate signals (e.g., commands or data) therebetween via an inter-peripheral com munication scheme (e.g., a bus, general purpose input and output (GPIO), serial pe ripheral interface (SPI), or mobile industry processor interface (MIPI)).

[172] According to an embodiment, commands or data may be transmitted or received between the electronic device 1401 and the external electronic device 1404 via the server 1408 coupled with the second network 1499. Each of the electronic devices 1402 and 1404 may be a device of a same type as, or a different type, from the electronic device 1401. According to an embodiment, all or some of operations to be executed at the electronic device 1401 may be executed at one or more of the external electronic devices 1402, 1404, or 1408. For example, if the electronic device 1401 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 1401, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 1401. The electronic device 1401 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example.

[173] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[174] It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be un derstood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C," may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as "1st" and "2nd," or "first" and "second" may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term "operatively" or "communicatively", as "coupled with," "coupled to," "connected with," or "connected to" another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.

[175] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry". A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC). [176] Various embodiments as set forth herein may be implemented as software (e.g., the program 1440) including one or more instructions that are stored in a storage medium (e.g., internal memory 1436 or external memory 1438) that is readable by a machine (e.g., the electronic device 1401). For example, a processor(e.g., the processor 1420) of the machine (e.g., the electronic device 1401) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one in struction invoked. The one or more instructions may include a code generated by a compiler or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[177] According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer.

The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore ⁷ ^)] ), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least tem porarily stored in the machine-readable storage medium, such as memory of the manu facturer's server, a server of the application store, or a relay server.

[178] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities.

According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or addi tionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various em bodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.