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Title:
ELECTRONIC DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/069129
Kind Code:
A1
Abstract:
An electronic device on which a plurality of substrates are stacked is provided. At least one substrate among the plurality of substrates is a silicon substrate of which a thickness is equal to or greater than 300 [μm]. A through hole that penetrates the substrate in a thickness direction is formed on the substrate. A value of a ratio (t/D) of the thickness (t) of the substrate to a minimum internal dimension (D) of one opening of the through hole is equal to or greater than 10.

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Inventors:
TAKAHASHI WATARU (JP)
Application Number:
PCT/JP2016/080881
Publication Date:
April 27, 2017
Filing Date:
October 18, 2016
Export Citation:
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Assignee:
SEIKO EPSON CORP (JP)
International Classes:
B41J2/16
Domestic Patent References:
WO2000050198A12000-08-31
Foreign References:
US20150251425A12015-09-10
US20120069094A12012-03-22
US20060012640A12006-01-19
US20150024605A12015-01-22
Attorney, Agent or Firm:
WATANABE Kazuaki et al. (JP)
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