Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/238717
Kind Code:
A1
Abstract:
The subject of the present invention is an electronic device and manufacturing method therefor. The present invention discloses an electronic device and manufacturing method therefor. A pattern circuit of each surface mounting structure of the electronic device is arranged on a substrate; at least two through holes respectively correspond to at least two signal lines of the pattern circuit; and two ends of at least one photoelectric element are respectively electrically connected to the at least two signal lines of the pattern circuit. Each connection pad group of a drive circuit board corresponds to each surface mounting structure, and at least two connection pads respectively correspond to at least two through holes of the surface mounting structure. At least two conductive elements of each conductive element group are corresponding to the at least two through holes provided in the surface mounting structure, and extend to a first surface and a second surface of the substrate; wherein the conductive elements arranged in each through hole respectively electrically connect the signal lines of each surface mounting structure to the connection pads of each connection pad group of the drive circuit board.
Inventors:
LI CHIN-TANG (CN)
Application Number:
PCT/CN2020/091206
Publication Date:
December 03, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
GIO OPTOELECTRONICS CORP (CN)
International Classes:
H01L27/32; H01L21/48; H01L21/60; H01L23/498; H01L25/16
Foreign References:
| KR20130092896A | 2013-08-21 | |||
| CN107452763A | 2017-12-08 | |||
| CN109461386A | 2019-03-12 | |||
| US20120223875A1 | 2012-09-06 | |||
| TW107122662A | 2018-06-29 | |||
| TW108107174A | 2019-03-05 | |||
| TW106136523A | 2017-10-24 | |||
| TW106116725A | 2017-05-19 |
Other References:
See also references of EP 3979327A4
Attorney, Agent or Firm:
JEEKAI & PARTNERS (CN)
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