Title:
ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/188543
Kind Code:
A1
Abstract:
This method involves at least: a step (1) for preparing a structure (100) provided with an adhesive film (50), which comprises a substrate layer (10), an adhesive resin layer (A) provided on a first side (10A) of the substrate layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided on the second side (10B) of the substrate layer (10) and which has an adhesive force that decreases with external stimulation, the electronic component (70), which is adhered to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80), which is adhered to the adhesive resin layer (B) of the adhesive film (50); at least one step (2) selected from a step (2-1) for lowering the water content in the adhesive film (50) and a step (2-2) for lowering the water content in the structure (100); and a step (3) for sealing the electronic component (70) with a sealing material (60).
Inventors:
IGARASHI KOUJI (DE)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
MIURA TORU (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
MIURA TORU (JP)
Application Number:
PCT/JP2019/011335
Publication Date:
October 03, 2019
Filing Date:
March 19, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L21/56; C09J7/38; C09J133/00; C09K3/10
Foreign References:
| JP2011134811A | 2011-07-07 | |||
| JP2004128337A | 2004-04-22 | |||
| JP2007027623A | 2007-02-01 | |||
| JP2011134811A | 2011-07-07 | |||
| JP2018066900A | 2018-04-26 |
Other References:
See also references of EP 3780072A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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