Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2008/032365
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electronic device composed of a substrate
having at least an electrode. A pattern of an electrostatic discharge protecting
section is formed in the vicinity of the electrode, and a solder resist layer is
formed on the substrate surface excluding at least the pattern. A solder is applied
on the pattern, and the solder is heated and clumped by the surface tension of the
solder, and an electrostatic discharge conductive section is formed on the pattern.
A circuit on the substrate of the electronic device can be protected from ESD,
without increasing the number of components and the number of processes, by thus
forming the electrostatic discharge conductive section with the solder.
Inventors:
SEKI DAISUKE (JP)
Application Number:
PCT/JP2006/318047
Publication Date:
March 20, 2008
Filing Date:
September 12, 2006
Export Citation:
Assignee:
FUJITSU LTD (JP)
SEKI DAISUKE (JP)
SEKI DAISUKE (JP)
International Classes:
H05F3/02; H05K9/00
Foreign References:
| JP2004342464A | 2004-12-02 | |||
| JPH098488A | 1997-01-10 |
Attorney, Agent or Firm:
MATSUKURA, Hidemi et al. (4-10 Higashi Nihonbashi 3-chom, Chuo-ku Tokyo 04, JP)
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