Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/171952
Kind Code:
A1
Abstract:
This electronic device is provided with: an electronic circuit for performing a prescribed process on a target object or a target space; and a resin molding which is formed so as to enclose the target object or target space and which supports the electronic circuit. The resin molding comprises a first resin molding and a second resin molding bonded to the first resin molding. The electronic circuit comprises: an electronic component which is embedded in the first resin molding so as to have electrodes exposed therefrom; and wires which are formed on the surface of the first resin molding so as to be connected to the electrodes. The first resin molding is disposed on the inner side with respect to the second resin molding. This configuration enables the resin molding surrounding the target object to stably support the electronic circuit that performs the prescribed process on said object.
Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2019/006287
Publication Date:
September 12, 2019
Filing Date:
February 20, 2019
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01L1/26; B29C45/14; G01L1/14; G01L1/24; H01L23/12; H01L23/29; H01L23/31; H01L33/48; H05K5/00
Foreign References:
| JP2001352032A | 2001-12-21 | |||
| JP2002299545A | 2002-10-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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