Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/007987
Kind Code:
A1
Abstract:
Provided are an electronic device and a method for manufacturing the same, the electronic device comprising: a wiring board having a mount surface; a plurality of electronic components mounted on the mount surface; a ground electrode surrounding at least one component among the plurality of electronic components; an insulating protective layer which coats the at least one electronic component; an electromagnetic wave shield layer which coats the insulating protective layer, and is electrically connected to the ground electrode, and which is a solidified product of an electromagnetic wave shield layer forming ink; and an insulating partition wall provided along an outer edge of the ground electrode.
Inventors:
FUJII YUSUKE (JP)
Application Number:
PCT/JP2022/024611
Publication Date:
February 02, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K1/02; C09D11/02; C09D11/30; H01L23/28; H05K9/00
Foreign References:
| JP2002164479A | 2002-06-07 | |||
| JP2019091866A | 2019-06-13 | |||
| JP2009062523A | 2009-03-26 | |||
| US20200303320A1 | 2020-09-24 | |||
| US5436203A | 1995-07-25 | |||
| JPH10214923A | 1998-08-11 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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