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Patent Searching and Data


Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/261993
Kind Code:
A1
Abstract:
An electronic device characterized by having: a substrate; a bonding layer provided upon the substrate and including more than 0% by mass and no more than 60% by mass copper having a crystal grain size of at least 50 nm; an electronic component provided upon the bonding layer; and a coating covering the sides of the bonding layer and including at least one type of compound selected from the group consisting of copper oxide (I) (Cu2O) and copper oxide (II) (CuO).

Inventors:
KIKUCHI, Tomonao (JP)
Application Number:
JP2020/022837
Publication Date:
December 30, 2020
Filing Date:
June 10, 2020
Export Citation:
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Assignee:
KYOCERA CORPORATION (JP)
International Classes:
B22F3/24; B22F7/08; B22F9/24; H01L33/62; H01L21/52; F21S8/08; F21S41/00
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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