ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

WIPO Patent Application WO/2023/286748

A1

A method for manufacturing an electronic device, comprising: a step for preparing an electronic board comprising a wiring board, an electronic component disposed on the wiring board, and a ground electrode; a step for forming an insulating layer comprising a cured film of an insulating layer forming ink, by providing a region on the wiring board that does not include the ground electrode and that includes the electronic component with the insulating layer forming ink, and irradiating the region with an active energy beam; and a step for forming an electrically conductive layer comprising a cured film of an ink for forming an electrically conductive layer, by providing the ink for forming the electrically conductive layer onto the insulating layer and at least a part of the ground electrode. The method satisfies 0