Title:
ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/092407
Kind Code:
A1
Abstract:
This electronic device (100) comprises an electronic component (12), a resin molded body (11) having the electronic component (12) embedded and fixed therein, and a flexible part (20) which is connected to the resin molded body (11). The flexible part (20) may be integrally formed with the resin molded body (11), for example. As a result of this configuration, it is possible to reduce the size and thickness of the electronic device (100).
Inventors:
KAWAI WAKAHIRO (JP)
KATSURAGAWA TETSUYA (JP)
KATSURAGAWA TETSUYA (JP)
Application Number:
PCT/JP2017/033675
Publication Date:
May 24, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K1/02; H01L21/56; H01L23/12; H01L23/28; H05K3/00
Domestic Patent References:
| WO2014185194A1 | 2014-11-20 |
Foreign References:
| JP2006196865A | 2006-07-27 | |||
| JP2011114138A | 2011-06-09 | |||
| JP2010062284A | 2010-03-18 | |||
| JP2015207703A | 2015-11-19 | |||
| JP2009147010A | 2009-07-02 | |||
| JPH04346490A | 1992-12-02 |
Other References:
See also references of EP 3544392A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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