Title:
ELECTRONIC DEVICE MID-FRAME AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/162217
Kind Code:
A1
Abstract:
The present invention relates to the field of the manufacturing of electronic parts and components. Disclosed is an electronic device mid-frame. The invention addresses a technical issue of user experience being negatively affected by excessively high temperatures at a local area of an electronic device. The mid-frame (102) comprises at least one first supporting fixed component (201) and at least one second supporting fixed component (202), wherein the first supporting fixed component (201) is connected to the second supporting fixed component (202). The first supporting fixed component (201) is manufactured using a material with a thermal conductivity equal or greater than 150 W/(m∙K),
and the second supporting fixed component (202) is manufactured using a material with a thermal conductivity not exceeding 150 W/(m∙K). The invention divides the mid-frame into multiple fixed components. The different fixed components are then separately manufactured using materials with different heat dissipation potential, thereby improving the heat dissipation potential of the mid-frame while reducing production costs.
Inventors:
CAI MING (CN)
Application Number:
PCT/CN2017/080774
Publication Date:
September 28, 2017
Filing Date:
April 17, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; C22C9/00; C22C9/06
Foreign References:
| CN103841784A | 2014-06-04 | |||
| CN105916348A | 2016-08-31 | |||
| CN104015009A | 2014-09-03 | |||
| CN203882256U | 2014-10-15 | |||
| CN104656807A | 2015-05-27 | |||
| US20010043880A1 | 2001-11-22 | |||
| EP2602338A1 | 2013-06-12 | |||
| JP2010067842A | 2010-03-25 |
Attorney, Agent or Firm:
E-TONE INTELLECTUAL PROPERTY FIRM (CN)
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