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Patent Searching and Data


Title:
ELECTRONIC DEVICE AND MULTILAYER CERAMIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/042846
Kind Code:
A1
Abstract:
This electronic device comprises a substrate with an electronic component mounted thereon, wherein the electronic component is provided with a connection terminal on a mounting surface side thereof, the connection terminal being R-shaped when observed in cross-section view. This multilayer ceramic substrate comprises a surface electrode for connecting to the connection terminal, and is characterized in that: a recess is provided on a mounting surface of the multilayer ceramic substrate, the recess being R-shaped when observed in cross-section view and being formed at a position that corresponds to the connection terminal; and the surface electrode is provided to at least a portion of the recess, and is conductive with the connection terminal.

Inventors:
OKA, Takahiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
TAKEMORI, Yuki (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
KISHIDA, Kazuo (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
KAWAKAMI, Hiromichi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
YAMAMOTO, Yukio (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
OTAKE, Kensuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2017/023542
Publication Date:
March 08, 2018
Filing Date:
June 27, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H05K1/18; H01L21/60; H01L23/13; H05K3/34
Foreign References:
JPH11121527A1999-04-30
JP2008021751A2008-01-31
JPH0241476U1990-03-22
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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