Title:
ELECTRONIC DEVICE PACKAGE, MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/086481
Kind Code:
A1
Abstract:
Provided is a semiconductor package or the like, which is advantageous to suppress manufacturing cost of the semiconductor device and is suitable for improving reliability of the semiconductor package for reinforcing a ground line and/or a power supply line. A semiconductor package (50) is provided with a semiconductor device (1) wherein an external electrode is formed on a circuit plane; an inserting substrate (2) forming a storing section wherein the semiconductor device (1) is arranged; and an interposer substrate (5), which is provided with a wiring pattern (7), with both ends bent along the inserting substrate (2). The inserting substrate (2) is formed of a conductive material, and is electrically connected to the ground line or the power supply line, in the wiring pattern (7) of the interposer substrate (5).
Inventors:
YAMAZAKI TAKAO (JP)
SOGAWA YOSHIMICHI (JP)
NISHIYAMA TOMOHIRO (JP)
SOGAWA YOSHIMICHI (JP)
NISHIYAMA TOMOHIRO (JP)
Application Number:
PCT/JP2007/051203
Publication Date:
August 02, 2007
Filing Date:
January 25, 2007
Export Citation:
Assignee:
NEC CORP (JP)
YAMAZAKI TAKAO (JP)
SOGAWA YOSHIMICHI (JP)
NISHIYAMA TOMOHIRO (JP)
YAMAZAKI TAKAO (JP)
SOGAWA YOSHIMICHI (JP)
NISHIYAMA TOMOHIRO (JP)
International Classes:
H01L23/12; H01L25/10; H01L25/11; H01L25/18
Foreign References:
| JP2004172322A | 2004-06-17 | |||
| JP2006013029A | 2006-01-12 | |||
| JP2004103843A | 2004-04-02 |
Attorney, Agent or Firm:
MARUYAMA, Takao (SAM Build. 3floor 38-23, Higashi-Ikebukuro 2-chom, Toshima-ku Tokyo 13, JP)
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