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Patent Searching and Data


Title:
ELECTRONIC DEVICE PACKAGE TAPE
Document Type and Number:
WIPO Patent Application WO/2017/168825
Kind Code:
A1
Abstract:
Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention is characterized by comprising: a base tape 2 that has a pressure-sensitive adhesion face; a metal layer 3 that has a predetermined planar shape and is disposed on the pressure-sensitive adhesion face of the base tape 2; a bonding adhesive layer 4 that has a predetermined planar shape and is laminated to the metal layer 3 on the side of the metal layer 3 opposite the base tape 2 side; and a pressure-sensitive adhesive tape 5 that covers the bonding adhesive layer 4 and has a label part 5a, which has a predetermined planar shape and is disposed so as to come into contact with the base tape 2 in the periphery of the bonding adhesive layer 4. The electronic device package tape 1 is further characterized in that the adhesive power P1 between the base tape 2 and the metal layer 3 is 0.01-0.5N/25mm, the adhesive power P2 between the base tape 2 and the pressure-sensitive adhesive tape 5 is 0.01-0.5N/25mm, and P1/P2 is 0.1-10.

Inventors:
SANO TORU (JP)
MARUYAMA HIROMITSU (JP)
SUGIYAMA JIROU (JP)
AOYAMA MASAMI (JP)
Application Number:
PCT/JP2016/084563
Publication Date:
October 05, 2017
Filing Date:
November 22, 2016
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B32B15/08; B32B27/00; C09J7/20; C09J11/04; C09J133/08; C09J163/00; H01L21/301; H01L23/00
Foreign References:
JP2010225651A2010-10-07
JP2012033626A2012-02-16
JP2007235022A2007-09-13
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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