ELECTRONIC-DEVICE PRODUCTION METHOD - MURATA MANUFACTURING CO

Title:

ELECTRONIC-DEVICE PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2014/021080

Kind Code:

A1

Abstract:

In an electronic-device production method in which ultrasonic bonding is used to produce an electronic-device component member, in cases when a first structure and a second structure are present in the electronic-device component member, a bonding condition, namely that the press-down amount on a material to be bonded be a prescribed value, said press-down amount being generated as a result of a protruded portion and a support portion of a horn respectively cutting into the material to be bonded during ultrasonic bonding, is acquired, as a first bonding condition and a second bonding condition corresponding respectively to the first structure and the second structure of the electronic-device component member to be produced, from a storage means in which each structure of the electronic-device component member is stored, and layered materials to be bonded corresponding respectively to the first structure and the second structure are subjected to ultrasonic bonding on the basis of these bonding conditions, thereby producing the electronic-device component member having the first structure and the second structure. As a result, provided is an electronic-device production method with which bonding failure and breakage of material to be bonded can be inhibited when forming a plurality of terminals bonded on a metal plate having an electronic device thereon.

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Inventors:

KANRYO KOICHI (JP)
ENDO HIROKI (JP)
FUJIKI HIDEYUKI (JP)

Application Number:

PCT/JP2013/069095

Publication Date:

February 06, 2014

Filing Date:

July 12, 2013

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H01G13/00; B23K20/10; H01G4/18; H01G9/008; H01G11/66; H01M50/566

Foreign References:

JP2005088067A	2005-04-07
JP2010029873A	2010-02-12
JP2006263816A	2006-10-05
JP2012079427A	2012-04-19

Attorney, Agent or Firm:

Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)

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