ELECTRONIC DEVICE PRODUCTION METHOD - MITSUI CHEMICALS TOHCELLO INC

Title:

ELECTRONIC DEVICE PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2020/184201

Kind Code:

A1

Abstract:

This electronic device production method at least comprises a preparation step for preparing a structure (100), and a sealing step for sealing an electronic component (70) using a sealing material (60). The structure (100) includes: an adhesive film (50) including a base material layer (10), an adhesive resin layer (A) that is provided to a first surface (10A) side of the base material layer (10) and used for provisionally immobilizing the electronic component (70), an adhesive resin layer (B) that is provided to a second surface (10B) side of the base material layer (10) and loses adhesiveness due to external stimulation, and an absorbent relief resin layer (C) that is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B); the electronic component (70) joined to the adhesive resin layer (A) of the adhesive film (50) and having a relief structure (75); and a support substrate (80) joined to the adhesive resin layer (B) of the adhesive film (50).

Inventors:

MIURA TORU (JP)
KURIHARA HIROYOSHI (JP)

Application Number:

PCT/JP2020/008092

Publication Date:

September 17, 2020

Filing Date:

February 27, 2020

Export Citation:

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Assignee:

MITSUI CHEMICALS TOHCELLO INC (JP)

International Classes:

H01L23/12; C09J7/38; C09J123/00; C09J125/04; C09J133/00; C09J175/04; C09J183/04; H01L21/56

Domestic Patent References:

WO2017170452A1	2017-10-05
WO2018021145A1	2018-02-01

Foreign References:

JP2018006541A	2018-01-11
JP2018157037A	2018-10-04
JP2011134811A	2011-07-07
JP2019046776A	2019-03-22

Other References: