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Title:
ELECTRONIC DEVICE-SEALED BODY, SHEET-SHAPED ADHESIVE, ADHESIVE FILM FOR SEALING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE-SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2019/189618
Kind Code:
A1
Abstract:
The present invention pertains to an electronic device-sealed body comprising an electronic device and an adhesive-cured layer that seals between a UV-impermeable functional film and the electronic device; a sheet-shaped adhesive that is used for forming the adhesive-cured layer; an adhesive film for sealing electronic device, the adhesive film having an adhesive layer made of the functional film and the sheet-shaped adhesive; and a method for manufacturing the electronic device-sealed body.

Inventors:
HASEGAWA TATSUKI (JP)
NISHIJIMA KENTA (JP)
MAETANI SHIHO (JP)
KASHIO MIKIHIRO (JP)
Application Number:
JP2019/013695
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H05B33/04; C08K5/00; C08K5/151; C08K5/54; C08L23/26; C08L63/00; C09J7/10; C09J7/24; C09J7/25; C09J7/30; C09J7/35; C09J11/06; C09J123/26; C09J163/00; C09K3/10; H01L23/29; H01L23/31; H01L51/50
Domestic Patent References:
WO2018047868A12018-03-15
WO2003106582A12003-12-24
WO2009054168A12009-04-30
Foreign References:
JP2012082266A2012-04-26
JP2017031383A2017-02-09
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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