Title:
ELECTRONIC DEVICE SEALING COMPOSITION, ELECTRONIC DEVICE SEALING FILM FORMING METHOD, AND ELECTRONIC DEVICE SEALING FILM
Document Type and Number:
WIPO Patent Application WO/2022/230637
Kind Code:
A1
Abstract:
An electronic device sealing composition according to the present invention contains photocurable monomers (A) and a photoinitiator (B). The photocurable monomers (A) include at least a chain-like (meth)acrylate monomer (A1) and a chain-like (meth)acrylate monomer (A2). The chain-like (meth)acrylate monomer (A2) has at least one of a phenyl group, heterocyclic group, or a cycloalkyl group, and further includes a metal-containing compound (C). The metal-containing compound (C) includes at least one among metal alkoxides, metal chelates, silane-based compounds, silazane-based compounds, and metal halides.
Inventors:
MAKISHIMA YUKIHIRO (JP)
HIROSAWA SHOTA (JP)
TAKEMURA CHIYOKO (JP)
MORIKAWA SHINICHIRO (JP)
MATSUMOTO SAYAKA (JP)
HIROSAWA SHOTA (JP)
TAKEMURA CHIYOKO (JP)
MORIKAWA SHINICHIRO (JP)
MATSUMOTO SAYAKA (JP)
Application Number:
PCT/JP2022/017320
Publication Date:
November 03, 2022
Filing Date:
April 08, 2022
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C08F20/00; C08F2/44; C08F2/50; C08K5/057; C08K5/541; C08K5/56; C08L33/14; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| WO2018105177A1 | 2018-06-14 | |||
| WO2014157642A1 | 2014-10-02 | |||
| WO2022039019A1 | 2022-02-24 |
Foreign References:
| US20140178675A1 | 2014-06-26 | |||
| KR20200054900A | 2020-05-20 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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