Title:
ELECTRONIC DEVICE SEALING COMPOSITION, ELECTRONIC DEVICE SEALING FILM, AND METHOD FOR FORMING ELECTRONIC DEVICE SEALING FILM
Document Type and Number:
WIPO Patent Application WO/2024/024942
Kind Code:
A1
Abstract:
This electronic device sealing composition contains a photopolymerizable monomer and a photopolymerization initiator. The electronic device sealing composition contains a (meth)acrylate as the photopolymerizable monomer. When the electronic device sealing composition is cured by irradiating with UV rays having a wavelength of 395 nm at 1.5 Jcm-2 in a nitrogen environment, the curing rate of the formed electronic device sealing film is 80% or above, and the residue rate of the electronic device sealing film as obtained by a differential thermal/thermogravimetric simultaneous measuring device (TG-DTA) is 3% or above.
Inventors:
HIROSAWA SHOTA (JP)
MORIKAWA SHINICHIRO (JP)
REN RIEKO (JP)
MORIKAWA SHINICHIRO (JP)
REN RIEKO (JP)
Application Number:
PCT/JP2023/027749
Publication Date:
February 01, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
H10K50/844; H10K59/10; H10K71/12; H10K77/10; H10K85/10; H10K101/30
Foreign References:
| JP2019140003A | 2019-08-22 | |||
| JP2021128938A | 2021-09-02 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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