Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/051178
Kind Code:
A1
Abstract:
An electronic device including a sealing member produced by polymerizing a polymerizable comoposition having a viscosity of less than 0.3 N.s.m?-2¿ at 23 °C and a modulus of elasticity of less than 500 MPa at 23 °C. Another electronic device including a sealing member produced by polymerizing a polymerizable composition containing an olefin compound and having a modulus of elasticity of less than 500 MPa at 23 °C.
Inventors:
SUGISHITA TAKUYA (JP)
AOKI TOMOAKI (JP)
YAMAZAKI HITOSHI (JP)
KAWAI HIROMASA (JP)
INOUE YOSHIKI (JP)
YASU KATSUHIKO (JP)
FUJITA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
SUZUKI MASAHIRO (JP)
AOKI TOMOAKI (JP)
YAMAZAKI HITOSHI (JP)
KAWAI HIROMASA (JP)
INOUE YOSHIKI (JP)
YASU KATSUHIKO (JP)
FUJITA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
SUZUKI MASAHIRO (JP)
Application Number:
PCT/JP2000/001112
Publication Date:
August 31, 2000
Filing Date:
February 25, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
SUGISHITA TAKUYA (JP)
AOKI TOMOAKI (JP)
YAMAZAKI HITOSHI (JP)
KAWAI HIROMASA (JP)
INOUE YOSHIKI (JP)
YASU KATSUHIKO (JP)
FUJITA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
SUZUKI MASAHIRO (JP)
SUGISHITA TAKUYA (JP)
AOKI TOMOAKI (JP)
YAMAZAKI HITOSHI (JP)
KAWAI HIROMASA (JP)
INOUE YOSHIKI (JP)
YASU KATSUHIKO (JP)
FUJITA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
SUZUKI MASAHIRO (JP)
International Classes:
C08L65/00; C08L101/16; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08L65/00
Foreign References:
| JPS62105610A | 1987-05-16 | |||
| JPH07102148A | 1995-04-18 | |||
| JPH05339341A | 1993-12-21 | |||
| JPH0697324A | 1994-04-08 |
Attorney, Agent or Firm:
Tomita, Kazuko (Kitasaiwai 2-chome Nishi-ku, Yokohama-shi Kanagawa, JP)
Download PDF:
Previous Patent: INTEGRATED CIRCUIT DEVICE WITH AIR DIELECTRIC
Next Patent: METHOD OF MANUFACTURING A LEADFRAME ASSEMBLY
Next Patent: METHOD OF MANUFACTURING A LEADFRAME ASSEMBLY