Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/073828
Kind Code:
A1
Abstract:
Provided is an electronic device constituted such that a sealing material can be uniformly heated and melted. The electronic device has: a support substrate (12) on which a sealed region is set; an electrical circuit (14) provided inside that sealed region; electrical wiring (15) provided so as to extend from inside the sealed region to outside the sealed region and electrically connecting electrical signal input and output sources and the electrical circuit; a sealing member (16) provided so as to surround the sealed region on the support substrate; and a sealing substrate (17) bonded to the support substrate via the sealing member. The electrical circuit is provided with an electronic element having an organic layer, and the electrical wiring in an intersecting region where the electrical wiring and sealing member intersect is constituted of translucent electrical wiring.
Inventors:
NISHIOKA YUKIYA (JP)
Application Number:
PCT/JP2011/077203
Publication Date:
June 07, 2012
Filing Date:
November 25, 2011
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
NISHIOKA YUKIYA (JP)
NISHIOKA YUKIYA (JP)
International Classes:
H05B33/04; G09F9/30; H01L27/32; H01L31/042; H01L51/50; H05B33/10; H05B33/26; H05B33/28
Foreign References:
| JP2005203286A | 2005-07-28 | |||
| JPH1074583A | 1998-03-17 | |||
| JP2003217837A | 2003-07-31 | |||
| JP2002359085A | 2002-12-13 | |||
| JP2003208975A | 2003-07-25 | |||
| JP2003272834A | 2003-09-26 | |||
| JP2008262749A | 2008-10-30 | |||
| JP2000021566A | 2000-01-21 | |||
| JP2007109645A | 2007-04-26 | |||
| JPH1152394A | 1999-02-26 | |||
| JPH08171097A | 1996-07-02 | |||
| JPH1185057A | 1999-03-30 | |||
| JP2007200835A | 2007-08-09 |
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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Claims: