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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2017/169760
Kind Code:
The purpose of the invention is to reduce, in an electronic device having an electrode formed on a principal surface, the misplacement of a probe pin or the breakage of the electrode. This electronic device 1a is an electronic device to which a probe pin is connected and that is used for electrically inspecting a semiconductor element etc., the electronic device having an electrode 3 formed on a principal surface 20 of a wiring board 2. A protruding part 5 is formed at the peripheral edge of a surface 30 of the electrode 3. The electrode 3 is formed by sequentially layering a Cu plating layer 3a, a Ni plating layer 3b, and an Au plating layer 3c. A projection 5a to 5c is formed in each plating layer 3a to 3c, thus forming the protruding part 5. The protruding part 5 serves as a guide for the probe pin, and when it seems likely that the probe pin will contact the vicinity of an end part of the electrode 3, the protruding part 5 guides the probe pin outside the electrode 3. Thus, it is possible to prevent the probe pin from touching the end part of the electrode 3 and breaking the electrode.

HATASE, Minoru (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
MIZUSHIRO, Masaaki (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
Publication Date:
October 05, 2017
Filing Date:
March 15, 2017
Export Citation:
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MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H05K3/40; G01R1/073; H01L21/66; H05K3/24; H05K3/46
Domestic Patent References:
Foreign References:
Attorney, Agent or Firm:
YANASE, Yuji et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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