Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/216627
Kind Code:
A1
Abstract:
According to the present invention, a heat sink (21) is arranged on the lower surface of a circuit board (10). The circuit board (10) has a through hole (h1) that penetrates through the circuit board (10) within a region (A) in which an integrated circuit device (5) is arranged. This through hole (h1) is provided with a heat conduction path (11). The heat conduction path (11) connects the integrated circuit device 5 and the heat sink (21) to each other. Due to this configuration, a component that is different from the heat sink (21) is able to be arranged on the same side as the integrated circuit device (5), and thus the degree of freedom in component layout is able to be increased.
Inventors:
SHIKAMA KAZUYUKI (JP)
USAMI MORIO (JP)
USAMI MORIO (JP)
Application Number:
PCT/JP2018/019358
Publication Date:
November 29, 2018
Filing Date:
May 18, 2018
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H01L23/40; H05K1/02; H05K7/20
Foreign References:
| JP2001284748A | 2001-10-12 | |||
| JPH0982857A | 1997-03-28 | |||
| JP2016111117A | 2016-06-20 | |||
| JP2015133373A | 2015-07-23 | |||
| JP2002118384A | 2002-04-19 | |||
| JP2014036033A | 2014-02-24 | |||
| JP2013105904A | 2013-05-30 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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