ELECTRONIC DEVICE

WIPO Patent Application WO/2020/217285

A1

This electronic device increases pressure resistance to a refrigerant in piping, improves electronic device assembly properties and enables greater electronic device compactness. This electronic device is provided with multiple substrates which comprise a substrate main body and a heat emitting element provided on the substrate main body and which are provided side by side in the plate thickness direction of the substrate main bodies, a cooler which is disposed between mutually adjacent substrates and inside of which a refrigerant flows and cools the heat generating elements, and piping which is connected to the cooler and which is configured from a metal. The piping comprises an inside piping section at least a part of which is arranged in an inter-substrate region and which is connected to the cooler, an inside piping extension part which is provided extending from the inside piping section to outside of the inter-substrate region, and an outside piping section which is arranged outside of the inter-substrate region and is connected to the inside piping extension part, wherein the outside piping section contains a deformable movable piping section.

KISE KOJI (JP)
ISHIKAWA HIROAKI (JP)
MORIYAMA TAKASHI (JP)
SAKATA YUKI (JP)

PCT/JP2019/017077

October 29, 2020

April 22, 2019

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MITSUBISHI ELECTRIC CORP (JP)

H05K7/20; F28D15/02; H01L23/473

US20100002393A1	2010-01-07
JPS62118553A	1987-05-29
JPS6094749A	1985-05-27
JPH07142656A	1995-06-02
JP2004011962A	2004-01-15
JP2004168285A	2004-06-17
JPH0590777A	1993-04-09

SOGA, Michiharu et al. (JP)

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